Interposer Conductor Segmentation for Voltage Drop Reduction
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Solution Overview
Problem
In semiconductor devices, the supply voltage applied to semiconductor elements through interposers often experiences drops due to resistance in fine wiring, leading to inadequate voltage delivery, which can hinder normal operation.
Innovation Solution
The interposer design includes a conductor portion within the substrate, connected via a connection conductor to a pad on the outermost insulating layer, allowing supply voltage to be applied directly from the substrate without traversing fine wiring, and utilizing thicker conductor portions and larger diameter via conductors to minimize voltage drops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If fine wiring is used in the interposer, then the device complexity is reduced and wiring density is improved, but voltage drops occur due to resistance leading to inadequate voltage delivery
Solution Approach 1:
The patent divides the wiring structure into two distinct segments: fine wiring for signal transmission and thick conductor portions for power supply. This segmentation allows each part to perform its optimal function - fine wiring maintains low device complexity while thick conductors ensure reliable voltage delivery without mixing the conflicting requirements in a single structure.
Solution Approach 2:
The patent applies different quality characteristics to different locations within the interposer. Thick conductor portions with large cross-sectional areas are strategically placed in regions requiring high current carrying capacity and low resistance, while fine wiring is used in regions where signal integrity and routing density are priorities. This local differentiation resolves the contradiction by matching structure to functional requirements.
2Reliability
If thick conductor portions are used, then voltage drops are minimized and voltage delivery is improved, but the interposer size and manufacturing complexity increase
Solution Approach 1:
The conductor system is segmented into thick power conductors and fine signal conductors, allowing voltage delivery reliability to be improved in critical areas without requiring all conductors to be thick. This segmentation limits the increase in manufacturing complexity to only the necessary regions.
Solution Approach 2:
The patent transitions from planar wiring to three-dimensional conductor structures by forming conductor portions that extend vertically through multiple insulating layers using via holes. This dimensional change allows thick conductors to be integrated into the interposer structure without proportionally increasing the lateral footprint, thus managing size while maintaining low resistance paths.
3Reliability
If conductor portions extend across multiple insulating layers, then direct voltage delivery is achieved bypassing fine wiring resistance, but manufacturing precision requirements increase
Solution Approach 1:
The patent establishes conductor portions in lower insulating layers before forming upper wiring layers, creating a predetermined low-resistance path for voltage delivery. This preliminary action ensures that thick conductors are in place to support subsequent fine wiring and pad structures, allowing voltage delivery reliability to be secured early in the manufacturing process without compromising final alignment precision.
Solution Approach 2:
The patent uses insulating layers as intermediary structures that facilitate precise alignment of conductors across multiple levels. These insulating layers provide mechanically stable platforms with controlled dielectric properties, enabling accurate positioning of thick conductor portions and fine wiring relative to each other, thus managing manufacturing precision requirements while achieving three-dimensional conductor integration.
Data Source
AI summary
An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion is formed inside the insulating layer or on the insulating layer. A first pad is configured to receive an electronic part, and is formed on an outermost insulating layer of the at least one insulating layer. A connection conductor is formed in the at least one insulating layer so as to electrically connect the conductor portion to the first pad.