Interposer Connector Partition Surface Area Reduction
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Solution Overview
Problem
Existing electrical connectors for chip modules to circuit boards have a large surface area on partitions due to protruding blocks and grooves, leading to increased intervals between terminals, hindering terminal intensification.
Innovation Solution
The design includes an insulating body with multiple rows of accommodating grooves and protruding blocks, where grooves are concavely formed on partitions or above them, allowing for a reduced surface area on partitions, thereby decreasing the interval between terminals and facilitating a more intensive terminal arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protruding blocks and grooves are provided on the partition surface, then the chip module can be supported and demolded, but the surface area of the partition increases, resulting in larger intervals between terminals
Solution Approach 1:
The groove is designed to extend in the vertical dimension from the partition surface downward into the partition thickness, rather than only occupying horizontal surface area. This dimensional transition allows the groove to provide necessary demolding function while minimizing the horizontal footprint on the partition surface, thereby reducing the interval between terminals.
Solution Approach 2:
The groove is localized to specific positions on the partition surface where demolding is needed, rather than uniformly distributing features across the entire partition. By concentrating the groove features only where necessary for chip module release, the overall partition surface area remains minimized, allowing tighter terminal spacing in other areas.
2Productivity
If the partition surface area is reduced to enable terminal intensification, then the interval between terminals decreases, but it becomes difficult to provide both protruding blocks and grooves for chip module support and demolding
Solution Approach 1:
The partition structure is segmented into distinct functional zones: protruding blocks for chip module support and grooves for demolding are separated into different spatial locations on the partition surface. This segmentation allows each feature to be optimized independently without interfering with the other, enabling terminal intensification while maintaining necessary support and demolding functions.
Solution Approach 2:
The groove feature transitions from a purely surface-level feature to a three-dimensional feature that extends vertically into the partition. This dimensional change allows the groove to provide adequate demolding function with reduced horizontal footprint, enabling closer terminal spacing while maintaining chip module support capability through properly positioned protruding blocks.
Data Source
AI summary
An electrical connector for electrically connecting a chip module, including an insulating body provided with multiple accommodating grooves in multiple rows and vertically passing through the insulating body. Each two adjacent accommodating grooves are provided with a partition or a space above the partition. The insulating body is concavely provided downward with at least one groove correspondingly located on the partition or in the space above the partition. The groove has a bottom surface and a side surface being closed and formed by extending upward from a periphery of the bottom surface, and the groove is configured for a pushing pin to push and eject the insulating body from a mold. The insulating body is protrudingly provided upward with a plurality of protruding blocks, configured to support the chip module. The groove and all the protruding blocks are not located on the same partition.