Interposer Cooling Patch Layout for Semiconductor Package Heat Control
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving improved reliability and efficient heat dissipation due to physical and economic limitations, particularly in managing heat generated by high-performance transistors and integrated circuits.
Innovation Solution
A semiconductor package design incorporating a package substrate, interposer, semiconductor chip, and cooling patches with cylindrical shapes and high thermal conductivity, along with an insulation filler, to enhance heat dissipation and maintain structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-performance transistors and integrated circuits are used to increase computing power and wireless communication capability, then system performance is improved, but heat generation increases making cooling difficult
Solution Approach 1:
The patent introduces a heat dissipation plate as an intermediary component between the semiconductor chip and the external environment. This plate serves as a thermal mediator that collects heat from multiple chips and directs it to cooling structures, effectively managing the heat generated by high-performance transistors without compromising system performance
Solution Approach 2:
The heat dissipation plate performs multiple functions: it acts as a thermal management component for cooling, provides mechanical support for mounting multiple semiconductor chips, and serves as a structural element that maintains package integrity. This multi-functionality allows effective heat management while preserving computing power
2Temperature
If cooling structures are added to manage heat dissipation, then temperature control is improved, but package structure complexity increases
Solution Approach 1:
The patent merges the heat dissipation plate with the package substrate structure, integrating thermal management functionality into the existing package architecture. By combining support and cooling functions into a single integrated structure, the design achieves effective heat dissipation without proportionally increasing overall package complexity
Solution Approach 2:
The patent optimizes the thickness and material properties of the heat dissipation plate to achieve effective heat dissipation within minimal dimensional constraints. By carefully controlling the plate's thermal conductivity and geometric parameters, efficient cooling is achieved while maintaining a compact package structure
3Productivity
If multiple semiconductor chips are integrated in a stack configuration, then system integration is improved, but heat accumulation and reliability issues worsen
Solution Approach 1:
The patent segments the heat dissipation function by providing individual heat dissipation plates for each semiconductor chip in the stack, rather than a single centralized cooling structure. This segmentation allows each chip's heat to be managed independently, improving thermal performance and reliability while maintaining high integration density
Solution Approach 2:
Individual heat dissipation plates serve as intermediary thermal management components between each semiconductor chip and the cooling system. These plates collect heat from specific chip locations and channel it to appropriate cooling structures, ensuring reliable temperature control in high-density stacked configurations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves cooling efficiency and reliability by effectively managing heat from high-performance transistors, preventing deformation of conductive connectors, and ensuring uniformity and stability of the package structure.
Implementation Method 1
thermal conductivity of each of the plurality of cooling patches is greater than thermal conductivity of the lower protective layer
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a package substrate, an interposer including a lower protective layer, conductive connectors connecting the package substrate to the interposer, a semiconductor chip arranged between the package substrate and the interposer, and cooling patches arranged between the semiconductor chip and the interposer and having cylindrical shapes, wherein each of the cooling patches includes the same material as each of the conductive connectors, a height of each of the cooling patches is less than or equal to a diameter of each of the cooling patches, and thermal conductivity of each of the cooling patches is greater than thermal conductivity of the lower protective layer.