Interposer Package Structure With Coplanar Heat Dissipation Die
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in reducing stress concentration and improving heat dissipation efficiency in integrated circuit packages due to the thickness differences between integrated circuit devices and the encapsulant, which can lead to die cracking and inefficient heat management.
Innovation Solution
Incorporating a heat dissipation die with high thermal conductivity, exposed through the encapsulant, and attaching a heat spreader to the top surface of the heat dissipation die to enhance thermal conductivity and reduce encapsulant thickness over thinner devices, thereby minimizing stress and improving heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the encapsulant thickness is reduced over thinner integrated circuit devices to minimize stress concentration, then die cracking is prevented, but heat dissipation efficiency deteriorates
Solution Approach 1:
The encapsulant is segmented into different thickness zones: a first thickness over the thinner integrated circuit device and a second greater thickness over the thicker integrated circuit device. This segmentation allows the encapsulant to provide adequate stress relief over thin devices while maintaining sufficient heat dissipation path length over thick devices that generate more heat.
Solution Approach 2:
The encapsulant thickness is locally optimized based on the underlying integrated circuit device thickness. Areas with thinner devices have reduced encapsulant thickness to minimize stress concentration, while areas with thicker devices have increased encapsulant thickness to maintain heat dissipation efficiency. This local quality variation resolves the contradiction between stress relief and heat dissipation.
2Productivity
If integrated circuit devices of different thicknesses are packaged together, then integration density is improved, but stress concentration increases leading to die cracking
Solution Approach 1:
The encapsulant thickness is locally adjusted according to the thickness of the underlying integrated circuit device. This creates variable stress distribution throughout the package, with thinner encapsulant over thin devices and thicker encapsulant over thick devices, preventing stress concentration while maintaining high integration density through mixed-thickness device packaging.
3Temperature
If encapsulant thickness is increased to improve heat dissipation, then heat dissipation efficiency is improved, but stress concentration increases causing die cracking
Solution Approach 1:
The encapsulant is divided into thickness segments corresponding to different device regions. This segmentation enables the structure to provide adequate thermal mass for heat dissipation while simultaneously creating stress relief zones over thinner devices, resolving the contradiction between heat dissipation requirements and stress concentration prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces stress concentration, prevents die cracking, and enhances heat dissipation efficiency by ensuring the heat dissipation die and encapsulant are coplanar with the top surface of the integrated circuit devices, improving the overall performance and reliability of the integrated circuit package.
Implementation Method 1
Inclusion of the heat dissipation die reduces the amount of encapsulant over the integrated circuit device(s) with lesser thicknesses, which can help avoid stress concentration and die cracking in the integrated circuit package. Further, a heat spreader may be attached to the top surface of the heat dissipation die, which can help improve heat dissipation efficiency in the integrated circuit package.
Implementation Method 2
a heat spreader may be attached to the top surface of the heat dissipation die, which can help improve heat dissipation efficiency in the integrated circuit package
Data Source
AI summary
In an embodiment, a device includes: an interposer; a first integrated circuit device attached to the interposer; a second integrated circuit device attached to the interposer adjacent the first integrated circuit device; a heat dissipation die on the second integrated circuit device; and an encapsulant around the heat dissipation die, the second integrated circuit device, and the first integrated circuit device, a top surface of the encapsulant being coplanar with a top surface of the heat dissipation die and a top surface of the first integrated circuit device.