Semiconductor Interposer Correction Circuit Impedance Matching
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Solution Overview
Problem
Current semiconductor devices face signal quality deterioration due to impedance mismatch in high-speed signal transmission paths, leading to signal reflection and degradation, particularly as operating frequencies increase, which existing technologies fail to adequately address.
Innovation Solution
Incorporating a correction circuit with capacitative elements strategically placed in the interposer to offset signal reflections by shifting the phase of reflected waves, thereby improving signal transmission characteristics by matching impedance across the transmission path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If signal transmission frequency is increased to improve communication speed, then communication speed is improved, but signal quality deteriorates due to impedance mismatch and signal reflection
Solution Approach 1:
An interposer substrate is introduced as an intermediary component between the semiconductor chip and the wiring substrate. The interposer includes a correction circuit with capacitative elements strategically positioned to compensate for impedance mismatch and suppress signal reflection, thereby maintaining signal quality while enabling high-speed communication
Solution Approach 2:
Capacitative elements with specific capacitance values are incorporated into the correction circuit to adjust and match the impedance parameters of the transmission path. By changing the electrical parameters (capacitance) of the circuit, the impedance is optimized to prevent signal reflection and maintain signal integrity at high frequencies
2Reliability
If correction circuit with capacitative elements is added to improve impedance matching, then signal quality is improved, but device complexity increases
Solution Approach 1:
The correction circuit is integrated into the interposer substrate, merging the impedance matching function with the existing interposer structure. This combines multiple functions (signal transmission, impedance matching, and electrical coupling) into a single integrated component, reducing overall device complexity while maintaining signal quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses signal reflection and enhances signal quality in high-speed transmission paths by ensuring impedance matching, thereby improving overall signal transmission characteristics and reducing signal loss.
Implementation Method 1
a first capacitative element CAP1... The other edge is coupled with the capacitative element CAP1
Data Source
AI summary
A semiconductor device with enhanced performance. The semiconductor device has a high speed transmission path which includes a first coupling part to couple a semiconductor chip and an interposer electrically, a second coupling part to couple the interposer and a wiring substrate, and an external terminal formed on the bottom surface of the wiring substrate. The high speed transmission path includes a first transmission part located in the interposer to couple the first and second coupling parts electrically and a second transmission part located in the wiring substrate to couple the second coupling part and the external terminal electrically. The high speed transmission path is coupled with a correction circuit in which one edge is coupled with a branching part located midway in the second transmission part and the other edge is coupled with a capacitative element, and the capacitative element is formed in the interposer.