Interposer-Based Electrical Connector Assembly for CPU Routing
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Solution Overview
Problem
The increasing density of conductors on CPUs complicates the routing of circuits on motherboards, especially when different types of conductors like grounding, power, and signal transmission are mixed within a limited region, making it difficult to efficiently categorize and connect them without resorting to expensive multilayer printed circuit boards.
Innovation Solution
An electrical connector assembly that uses an interposer with both exposed and hidden conductive elements to connect CPU conductors to a main board, allowing for efficient grouping and routing of different characteristic conductors, eliminating the need for dense circuit arrangements and expensive multilayer boards by using a connector with an interposer sandwiched between the CPU and the main board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conductors on the CPU are arranged densely to increase connection capacity, then the number of conductors that can be connected increases, but the difficulty of routing circuits on the motherboard increases
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the CPU and the motherboard. This interposer has a first surface that contacts the CPU conductors and a second surface that provides connection points for the motherboard. By placing this intermediary layer, the patent decouples the dense CPU conductor arrangement from the motherboard routing requirements, allowing each side to be optimized independently without directly complicating the other.
2Area of stationary object
If different characterized conductors are mixed within a limited region to save space, then the connection density increases, but the capability of categorizing different characterized conductors efficiently decreases
Solution Approach 1:
The interposer is divided into distinct functional regions: a first surface for contacting CPU conductors, a body portion with internal conductive paths, and a second surface with connection points. This segmentation allows different characterized conductors (grounding, power, low-speed signal, high-speed signal) to be grouped and routed through separate pathways within the interposer structure, enabling efficient categorization while maintaining high connection density in a limited area.
3Device complexity
If expensive multilayer printed circuit boards are used to route dense conductors, then the circuit routing capability improves, but the manufacturing cost increases
Solution Approach 1:
The patent extracts the complex routing function from the motherboard and relocates it to a separate interposer component. Instead of using expensive multilayer PCBs to handle all routing complexities on the motherboard, the interposer is designed with specific internal conductive paths and structures that manage the dense conductor connections. This extraction allows the motherboard to remain simpler and less expensive while the interposer handles the complex routing requirements.
Data Source
AI summary
An electrical connector assembly provides an electrical connector mounted upon a main board, a CPU assembled upon connector with an interposer therebetween wherein some conductors on the CPU are electrically connected to the main board or to an external device via the conductive elements on the outer/exposed region of the interposer outside of the connector and a connection device, e.g., the connector set or the cable set, which is linked to those conductive elements on the outer/exposed region, while remaining conductors on the CPU are electrically connected to the main board via the conductive elements on the inner/hidden region of the interpose inside the connector by cooperation with the contacts of the connector.