Interposer Dam and Elastic Stress Relief for Package Warpage
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Solution Overview
Problem
Warpage and peeling occur in semiconductor devices due to differences in thermal expansion coefficients between materials, leading to reliability issues in high-density interconnection packages.
Innovation Solution
A semiconductor package design incorporating a molded interposer with a dam structure and stress relief using an elastic member to fill gaps between semiconductor devices and the dam structure, along with a package substrate and interposer configuration to enhance rigidity and reduce stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon interposer is used for high density interconnection, then interconnection performance is improved, but warpage occurs due to difference in coefficients of thermal expansion
Solution Approach 1:
The patent uses a molded interposer made of composite material (mold compound) instead of pure silicon. The interposer includes a body portion and a reinforcement portion with different material properties, creating a composite structure that balances thermal expansion coefficients and reduces warpage while maintaining high density interconnection performance
Solution Approach 2:
The interposer is divided into two distinct portions: a body portion and a reinforcement portion. The reinforcement portion has different material composition and thermal expansion properties compared to the body portion, allowing each segment to compensate for thermal stress differently and preventing overall warpage of the interposer
2Reliability
If multiple materials are stacked in high density interconnection package, then interconnection density is improved, but peeling occurs due to increase in stress between interfaces
Solution Approach 1:
The reinforcement portion of the molded interposer is strategically positioned at specific locations where stress concentration occurs at material interfaces. This localized reinforcement provides additional mechanical support and stress distribution exactly where needed, preventing peeling at critical interfaces without affecting overall interconnection density
Solution Approach 2:
The reinforcement portion acts as a preventive measure against future stress-induced peeling. By incorporating this reinforcing structure during manufacturing, the package is pre-equipped with stress-distributing elements that cushion against thermal and mechanical stresses before they can cause interface delamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces stress and prevents peeling or cracking, improving the reliability of the semiconductor package by enhancing the interposer's rigidity and maintaining structural integrity.
Implementation Method 1
a stress relief on the interposer, the stress relief including an elastic member that fills gaps between the semiconductor devices and the dam structure
Implementation Method 2
there is a problem in that warpage occurs due to a difference in coefficients of thermal expansion between individual components constituting the electronic device
Data Source
AI summary
A semiconductor package includes a package substrate, an interposer on the package substrate, a plurality of semiconductor devices on the interposer and spaced apart from each other, the semiconductor devices being electrically connected to the interposer, a dam structure on the interposer extending along a peripheral region of the interposer, the dam structure being spaced apart from the semiconductor devices, and a stress relief on the interposer, the stress relief including an elastic member that fills gaps between the semiconductor devices and the dam structure.