Interposer DCT Layout for Embedded Die Shift Compensation
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in producing smaller semiconductor devices with higher density and functionality, particularly in integrating multiple semiconductor die within a single package, which can lead to alignment issues and inefficiencies in electrical interconnection.
Innovation Solution
The implementation of displacement compensation traces (DCTs) in an embedded component interposer or substrate, which compensates for component shifts during manufacturing by forming interconnect pads and traces with unit-specific patterning, allowing for precise alignment and connection of chips or chiplets, even when shifts occur.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor die are integrated within a single package, then device functionality and density are improved, but alignment precision deteriorates due to manufacturing shifts
Solution Approach 1:
The patent applies preliminary action by pre-forming displacement compensation traces on the interposer substrate before component mounting. These traces are designed with specific geometries (meandering patterns, loops, or expansion joints) that anticipate and compensate for thermal expansion and manufacturing misalignments that will occur during subsequent packaging and operation, thereby maintaining alignment precision while enabling multi-die integration
Solution Approach 2:
The patent employs parameter changes by modifying the geometric parameters of the interconnect traces through displacement compensation designs. The traces incorporate variable path lengths, curvature radii, and segmentation that allow them to flexibly accommodate dimensional changes and position shifts, transforming rigid alignment requirements into flexible compensation mechanisms
2Adaptability or versatility
If interconnect traces are extended to compensate for component shifts, then alignment flexibility is improved, but trace length increases causing signal loss
Solution Approach 1:
The patent applies segmentation by dividing the interconnect path into multiple discrete trace segments separated by displacement compensation features. This segmentation allows each segment to be optimized for signal integrity while the compensation features between segments handle the alignment flexibility requirements, preventing signal degradation that would occur in a single long continuous trace
Solution Approach 2:
The patent utilizes another dimension by implementing displacement compensation in the vertical or lateral dimensions rather than simply extending the trace length in the signal path dimension. The compensation traces use meandering patterns, loops, or out-of-plane structures that provide alignment tolerance without proportionally increasing the electrical path length, thus maintaining signal integrity
3Productivity
If unit-specific patterning is used for interconnect pads, then manufacturing efficiency is improved, but process complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-defining standardized interconnect pad patterns and displacement compensation trace designs on the interposer substrate before component mounting. These pre-configured patterns are designed to accommodate various component types and positions, allowing for efficient pick-and-place manufacturing while reducing the need for complex post-alignment adjustments
Solution Approach 2:
The patent implements universality by designing interconnect pad structures that serve multiple functions: electrical connection, alignment reference, and displacement compensation. These universal pads can accommodate different component types and position variations without requiring completely different patterning approaches, thereby improving manufacturing efficiency while managing process complexity through standardization
Data Source
AI summary
A substrate comprising a region of displacement compensation traces (DCTs), a component comprising conductive contacts, interconnect pads formed in an interconnect pad region over the component according to a nominal design position, first and second embedded components, and a region of DCTs comprising at least one arrangement of DCTs with unit specific patterning such that the arrangement of DCTs is coupled to, and extends between, the conductive contacts and the interconnect pads. The arrangement of DCTs comprises a first arrangement of DCTs configured to compensate for a shift of the first embedded component during processing, a second arrangement of DCTs configured to compensate for a shift of the second embedded component, different than the shift of the first embedded component, during the processing and traces on one or more vertically separated RDL layers that extend between two termini and a majority of the traces comprise distances between the termini of the traces that is less than an interconnect pad pitch.