Interposer Dicing Fixture with UV Erasable Adhesive
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Solution Overview
Problem
Conventional dicing techniques for interposer assemblies with integrated circuit dies and solder balls on both sides cause damage, such as wafer chipping, demounting of ICs, and loss of known good dies due to vibration and non-planar surfaces, leading to reduced manufacturing yields and increased costs.
Innovation Solution
A wafer carrier assembly with preformed tape and a fixture that secures the interposer assembly during dicing, providing support and preventing damage by filling gaps between dies and edges, and using UV erasable adhesive for easy release after dicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional dicing techniques are used on interposer assemblies with ICs and solder balls mounted on both sides, then the dicing operation can be performed, but damage occurs including wafer chipping, demounting of ICs, and loss of known good dies due to vibration and non-planar surfaces
Solution Approach 1:
A planarizer is introduced as an intermediary component between the dicing saw blade and the interposer assembly. The planarizer provides a flat, stable mounting surface that distributes cutting forces evenly across the interposer, preventing vibration-induced damage to ICs and solder balls while enabling conventional dicing operations to proceed successfully
Solution Approach 2:
The interposer is mounted on a support structure with cushioning elements positioned beforehand to absorb and dampen vibration forces during the dicing operation. This pre-positioned cushioning prevents damage to mounted components by mitigating the harmful effects of blade vibration before they can cause damage
2Productivity
If the interposer assembly is mounted on conventional dicing tape, then the dicing operation can be performed, but tape peel-off occurs and damage is induced due to non-planar surfaces on either side of the interposer
Solution Approach 1:
A planarizer serves as an intermediary mounting platform that provides a perfectly flat surface for securing the interposer assembly during dicing. This planarizer interface eliminates surface planarity issues by distributing the mounting interface across a large, flat area, preventing tape peel-off and ensuring stable positioning throughout the dicing operation
Solution Approach 2:
The mounting system is segmented into distinct functional layers: a planarizer base layer providing structural support and planarity, an intermediate adhesive layer for secure bonding, and a protective top layer. This segmentation allows each layer to optimize its specific function, with the planarizer base ensuring surface planarity independent of the interposer's non-planar surfaces
3Productivity
If through vias or through silicon vias (TSVs) are used to enable wafer level processing and vertical stacking, then component density and system performance increase, but the complexity of the dicing operation increases due to mounted components on both sides
Solution Approach 1:
The planarizer mounting system serves multiple functions simultaneously: it provides a stable mounting platform for the interposer assembly, distributes cutting forces to prevent damage to TSVs and mounted components, absorbs vibration, and enables safe dicing of assemblies with components on both sides. This multi-functionality simplifies the overall dicing operation despite the increased complexity of processing high-density TSV assemblies
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces damage to interposers and ICs, increases yield, and lowers unit costs by ensuring secure mounting and easy separation of individual assemblies during the dicing process.
Implementation Method 1
using UV erasable adhesive for easy release after dicing
Data Source
AI summary
Apparatus for performing dicing of die on wafer interposers. Apparatuses are disclosed for use with the methods of dicing an interposer having integrated circuit dies mounted thereon. An apparatus includes a wafer carrier mounted in a frame and having a size corresponding to a silicon interposer, a fixture mounted to the wafer carrier and comprising a layer of material to provide mechanical support to the die side of the silicon interposer, the fixture being patterned to fill spaces between integrated circuit dies mounted on an interposer; and an adhesive tape disposed on a surface of the fixture for adhering to the surface of a silicon interposer. Additional alternative apparatuses are disclosed.