3D Semiconductor Interposer with Die Cavity for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current 3D semiconductor packages face limitations in reducing form factor and increasing pin count due to physical constraints in two-dimensional integration and the complexity of packaging-on-packaging techniques, which hinder further density improvements and heat dissipation.
Innovation Solution
The use of an interposer with a substrate cavity allows for smaller conductive bumps and a higher pin count, along with thermal management through a thermal pad or heat conductive pad, enabling a thinner and more efficient 3D semiconductor package with improved heat dissipation and reduced stress between dies and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If packaging-on-packaging techniques are used to stack dies, then form factor is reduced, but device complexity increases and pin count is limited
Solution Approach 1:
An interposer substrate is introduced as an intermediary component between the first and second dies. The interposer provides a platform for mounting both dies in a stacked configuration while offering through-substrate vias for electrical interconnections. This mediator structure simplifies the overall packaging complexity by centralizing the interconnection functions in a dedicated substrate rather than requiring direct die-to-die bonding and complex wire bonding arrangements.
Solution Approach 2:
The patent transitions from two-dimensional planar packaging to three-dimensional stacked packaging by mounting the first die on one surface of the interposer and the second die on the opposite surface. This vertical stacking approach reduces the form factor by utilizing the third dimension (height) for integration, thereby achieving higher density without increasing the footprint area.
2Quantity of substance
If conventional interposer packaging is used, then pin count is limited, but manufacturing precision requirements increase
Solution Approach 1:
The interconnection system is segmented into multiple independent pathways: through-substrate vias within the interposer for vertical connections, and wire bonds extending from the dies to contact pads on the interposer for lateral connections. This segmentation allows each connection type to be optimized independently, increasing the total pin count without proportionally increasing alignment complexity, as wire bonds can accommodate larger tolerances compared to direct solder bump connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a more compact package with increased density, reduced operating temperature, and lower power consumption, while minimizing thermal crosstalk and stress, thereby enhancing the overall performance and efficiency of the semiconductor device.
Implementation Method 1
a thermal pad or heat conductive pad, enabling a thinner and more efficient 3D semiconductor package with improved heat dissipation
Data Source
AI summary
Disclosed herein is a method of forming a device, comprising mounting a plurality of first interconnects on one or more first integrated circuit dies. One or more second integrated circuit dies are mounted on a first side of an interposer. The interposer is mounted at a second side to the first integrated circuit dies, the plurality of first interconnects disposed outside of the interposer. The interposer is mounted to a first side of a substrate by attaching the first interconnects to the substrate, the substrate in signal communication with one or more of the first integrated circuit dies through the first interconnects.