Interposer Edge Ring Mesh for Dicing Crack Resistance
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Solution Overview
Problem
In current 3D packaging architectures, the edge of the active area in interposers is poorly defined, leading to risks of delamination and microcracks during dicing operations, which affects the reliability and precision of microelectronic assemblies.
Innovation Solution
A microelectronic assembly design featuring an interposer with an edge ring comprising stacked metal traces and metal vias, forming a mesh structure, which anchors the redistribution layers and defines the active region, preventing delamination and microcracks by providing physical edge definition and anchoring points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the edge of the active area in interposers is not defined, then the manufacturing process is simpler, but delamination and microcracks occur during dicing operations
Solution Approach 1:
The edge ring is segmented into multiple stacked metal traces separated by dielectric material, creating a mesh structure that provides anchoring points along the periphery. This segmentation allows the structure to prevent delamination and microcracks while maintaining manufacturability through standard fabrication processes.
Solution Approach 2:
The solution transitions from a two-dimensional planar structure to a three-dimensional stacked mesh structure by adding vertical layers of metal traces separated by dielectric material. This dimensional change creates multiple anchoring points throughout the thickness of the interposer, effectively preventing delamination without significantly increasing planar footprint.
2Reliability
If an edge ring structure is added to anchor redistribution layers, then delamination and microcracks are prevented, but device complexity increases
Solution Approach 1:
The edge ring mesh structure serves multiple functions simultaneously: it provides mechanical anchoring for redistribution layers, defines the periphery of the active region for precise dicing, and creates a mesh pattern that prevents both delamination and microcrack propagation. This multi-functionality reduces the need for separate structural elements.
Solution Approach 2:
The edge ring is constructed as a composite structure with alternating layers of conductive metal traces and insulating dielectric material. This composite approach provides both mechanical strength for anchoring and electrical isolation, while the layered structure can be integrated into existing multi-layer interposer fabrication processes.
3Manufacturing precision
If the active region periphery is not defined, then manufacturing is easier, but precision during singulation and metrology deteriorates
Solution Approach 1:
The edge ring mesh structure is formed during the interposer fabrication process before dicing operations. The stacked metal traces and dielectric layers are deposited and patterned in advance, creating a pre-defined periphery that guides subsequent singulation and metrology processes without requiring additional definition steps.
Data Source
AI summary
A microelectronic assembly is provided, comprising: an interposer having a first face and a second face opposite to the first face; a package substrate coupled to the first face; an integrated circuit die coupled to the second face; and an edge ring in the interposer. The interposer comprises a core comprising a first dielectric material and a redistribution layer (RDL), the RDL being on the first face or the second face, the RDL comprising a second dielectric material different from the first dielectric material, and the edge ring comprises: a metal trace in contact with the second dielectric material, the metal trace being along a periphery of the interposer, and a plurality of metal vias through the RDL, the plurality of metal vias in contact with the metal trace.