Interposer Electrode Design for Multilayer Capacitor Vibration Isolation
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Solution Overview
Problem
Existing electronic components with multilayer capacitors and interposers fail to adequately suppress the propagation of electrostrictive vibrations, leading to audible buzzing when mounted on electronic devices due to the mechanical strain caused by applied voltage.
Innovation Solution
The design features a multilayer capacitor with a substrate interposer having specific connection electrode configurations and dimensions, where the first and second connection electrodes have portions located away from the edges, and third connection electrodes with narrower widths, limiting solder spread and reducing vibration propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder flows into recesses to directly connect the multilayer capacitor and the electronic device, then connection strength is improved, but vibration propagation increases causing buzzing
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the multilayer capacitor and the electronic device. The interposer includes a substrate with connection electrodes that are positioned away from the edges, creating an indirect connection path. This intermediary structure breaks the direct vibration transmission path while maintaining electrical connection, thereby reducing buzzing caused by vibration propagation.
Solution Approach 2:
The connection path is segmented into multiple parts: the multilayer capacitor connects to connection electrodes on the substrate, which then connect to terminal electrodes. The connection electrodes are positioned away from the edges of the substrate, creating separate zones for electrical connection and mechanical support. This segmentation allows the connection to be made without direct edge-to-edge contact, reducing vibration transmission.
2Object-generated harmful factors
If connection electrodes are positioned away from edges with narrower widths, then vibration propagation is reduced, but connection area decreases
Solution Approach 1:
The patent applies different qualities to different parts of the connection structure. The connection electrodes have narrower widths and are positioned away from the edges, creating a local zone with reduced mechanical coupling for vibration isolation. Meanwhile, the terminal electrodes and substrate provide sufficient overall connection area for electrical performance. This local quality differentiation allows vibration reduction without sacrificing necessary connection area.
3Object-generated harmful factors
If the interposer uses a compact design with electrodes away from edges, then buzzing is suppressed, but device complexity increases
Solution Approach 1:
The interposer substrate serves multiple functions simultaneously: it provides mechanical support for the multilayer capacitor, creates vibration isolation through its substrate structure, establishes electrical connections via connection electrodes and terminal electrodes, and enables compact packaging. By integrating these multiple functions into a single component, the patent suppresses buzzing without proportionally increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes solder fillets and connection areas, effectively reducing the transmission of vibrations from the multilayer capacitor to the electronic device, thereby satisfactorily suppressing buzzing and achieving reduced ESL through shorter electric current paths.
Implementation Method 1
When a voltage is applied to a multilayer capacitor, mechanical strain arises in magnitude depending upon the applied voltage in an element body due to an electrostrictive effect. This mechanical strain causes vibration of the multilayer capacitor (which will be referred to hereinafter as electrostrictive vibration).
Implementation Method 2
When the electronic component is mounted by soldering on the electronic device, solder flows into the recesses. The solder flowing into the recesses becomes solidified in the recesses. The solidified solder in the recesses directly connects the multilayer capacitor and the electronic device.
Data Source
AI summary
An interposer includes a plurality of first connection electrodes each of which is arranged on either of first- and second-side-surface sides of a first principal surface of a substrate; a plurality of second connection electrodes each of which is arranged on either of first- and second-side-surface sides of a second principal surface of the substrate; and a plurality of third connection electrodes each of which is arranged on either of first and second side surfaces. Each of the first connection electrodes has a first portion located away from an edge of the first principal surface, and a second portion extending from the first portion to the edge and connected to the third connection electrode. Each of the second portion of each first connection electrode and the plurality of third connection electrodes has a width smaller than a width of the first portion of each first connection electrode.