Interposer Substrate With Embedded Memory for Shorter Signal Paths
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Solution Overview
Problem
The need for interposer substrates to provide more functions, such as reducing memory footprint and signal transfer distance, while enhancing electrical performance, has grown in semiconductor elements.
Innovation Solution
Incorporating memory within the interposer substrate, which is disposed under the core region of a control circuit die, to decrease signal transfer distance, power consumption, and latency, and allowing memory capacity tuning without footprint penalty, along with integrated passive devices for electrical performance enhancement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If memory is integrated within the interposer substrate, then signal transfer distance and power consumption are reduced, but device complexity increases
Solution Approach 1:
The patent merges the memory function with the interposer substrate by integrating memory cells, bit lines, word lines, and select lines directly into the substrate structure. This consolidation eliminates the need for separate memory packages and reduces signal transfer distance between logic circuits and memory, thereby reducing power consumption while accepting increased device complexity as a trade-off for achieving lower energy usage and higher integration density.
2Quantity of substance
If memory capacity is increased within the interposer substrate, then application requirements are better met, but chip area increases
Solution Approach 1:
The patent utilizes three-dimensional vertical stacking to increase memory capacity without proportionally increasing chip area. Memory structures are arranged in multiple layers with through-substrate vias connecting different levels, allowing memory capacity to be scaled by adding vertical layers rather than expanding horizontal footprint. This dimensional transition enables higher memory capacity while maintaining compact chip area.
3Adaptability or versatility
If more components are integrated into the interposer substrate, then functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the interposer substrate into distinct functional regions including logic circuit regions, memory regions, and I/O regions, each with dedicated circuit blocks. This segmentation allows independent design, fabrication, and testing of different functional modules before integration, thereby enhancing overall functionality while managing manufacturing complexity through modular fabrication processes and standardized interconnect structures.
Data Source
AI summary
Disclosed are an interposer substrate, a package structure and a manufacturing method of a package structure. In one embodiment, the interposer substrate includes a substrate, a bridge device in the substrate, a memory in the substrate and beside the bridge device and a through substrate via in the substrate and beside the bridge device and the memory.