Interposer Embedded Passive Components IC Module Size Reduction
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Solution Overview
Problem
The challenge is to reduce the size of integrated circuit (IC) modules while maintaining structural stability and electrical connectivity, as existing methods of embedding passive components beneath the IC package increase height and require costly redesigns due to the need to depopulate solder balls, compromising both structural integrity and thermal dissipation.
Innovation Solution
Incorporating a passive component into an interposer with an encapsulation layer and interconnects, which is then coupled to the IC package and PCB using solder interconnects, allowing for reduced module size without depopulating solder balls and maintaining structural and thermal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components are mounted on the PCB surface, then electrical functionality is achieved, but the module occupies excessive real estate area
Solution Approach 1:
The patent moves passive components from the traditional PCB surface mounting to a vertical arrangement within the IC module structure. Specifically, passive components are placed on the PCB and then encapsulated by an encapsulant material, effectively utilizing the vertical dimension (Z-axis) rather than consuming additional horizontal PCB area. This dimensional transition resolves the contradiction by achieving compact integration without complicating the manufacturing process.
2Area of stationary object
If passive components are positioned underneath the IC package, then PCB area is reduced, but the overall module height increases
Solution Approach 1:
The patent merges multiple functions into a single integrated structure. The encapsulant material simultaneously serves as the encapsulation medium for the passive components and as the structural element that defines the module's external profile. By combining the encapsulation function with the passive component housing function, the design achieves compact PCB footprint without proportionally increasing module height, as the encapsulant fills the vertical space efficiently rather than requiring additional height for separate component mounting structures.
3Device complexity
If solder balls are depopulated to accommodate passive components, then component integration is achieved, but electrical paths and structural stability are compromised
Solution Approach 1:
The patent introduces an intermediary encapsulant material that mediates between the passive components and the PCB substrate. This encapsulant serves as a bonding medium that attaches the passive components to the PCB while preserving the original solder ball array configuration. The intermediary encapsulant material enables component integration without requiring removal of solder balls, thereby maintaining both electrical connectivity pathways and structural stability provided by the complete solder ball array.
4Volume of stationary object
If module size is reduced, then device compactness is improved, but thermal dissipation capabilities may be compromised
Solution Approach 1:
The patent applies local quality by creating distinct thermal management zones within the compact module structure. The encapsulant material is positioned to provide thermal pathways specifically in regions where heat generation occurs, while maintaining compact overall dimensions. By optimizing the local thermal properties and pathways within the encapsulant structure, the design achieves effective heat dissipation despite reduced module volume, as thermal management is addressed locally rather than requiring proportional increases in overall module size.
Data Source
AI summary
An integrated circuit (IC) module that includes an integrated circuit (IC) package, a plurality of first solder interconnects coupled to the IC package, an interposer coupled to the IC package through the plurality of first solder interconnects a plurality of second solder interconnects coupled to the interposer; and a printed circuit board (PCB) coupled to the interposer through the plurality of second solder interconnects. The interposer includes an encapsulation layer, a first passive component at least partially embedded in the encapsulation layer, and a plurality of interconnects coupled to the first passive component. The encapsulation layer includes a mold and/or an epoxy fill. The first passive component is configured to operate as an electronic voltage regulator (EVR) for the IC module. In some implementations, the interposer is a fan out interposer.