Interposer-Embedded PCB for Slim Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional printed circuit boards struggle to accommodate semiconductor chips with fine pitches due to limitations in fine pitch capability, leading to increased thickness of semiconductor packages when using conventional interposers mounted on one side.
Innovation Solution
An interposer-embedded printed circuit board design where an interposer with micro wiring and insulating regions is embedded within the substrate, allowing for a cavity to house the interposer and maintain a slim package thickness, with exposed sides for improved radiation performance and optional passive component integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer is mounted on one side of a printed circuit board to connect fine pitch semiconductor chips, then the connection between chip and board is achieved, but the package thickness increases
Solution Approach 1:
The interposer is embedded within a cavity formed in the substrate, nesting the interposer inside the substrate volume rather than mounting it externally. This allows the interposer to be housed within the existing package footprint, reducing the overall package thickness while maintaining the fine pitch connection capability.
Solution Approach 2:
The interposer is positioned in a cavity at a specific depth within the substrate, utilizing the vertical dimension (z-axis) to accommodate the interposer. The cavity has a predetermined height that positions the interposer at an optimal depth, allowing one side of the interposer to be exposed at the substrate surface for bump formation while the other side connects to internal circuit layers.
2Length of stationary object
If an interposer is embedded in the substrate to reduce package thickness, then the package becomes thinner, but the manufacturing complexity increases
Solution Approach 1:
The cavity is formed in the substrate before the interposer is mounted. This preliminary action of creating the cavity in advance allows the interposer to be precisely positioned and embedded during subsequent manufacturing steps, simplifying the overall process compared to attempting to embed the interposer after substrate fabrication.
Solution Approach 2:
The substrate is divided into distinct regions including the cavity area and surrounding circuit layers. The circuit layers are formed separately and connected to the interposer through connection patterns, allowing independent fabrication and assembly of components that are later integrated into the final structure.
3Length of stationary object
If the interposer is fully embedded in the substrate, then the package thickness is minimized, but the radiation performance deteriorates
Solution Approach 1:
The interposer is partially embedded with one side exposed at the substrate surface, creating different functional zones: the embedded portion provides mechanical support and electrical connection, while the exposed portion enables radiation emission. This local differentiation of the interposer structure simultaneously achieves thickness reduction and maintains radiation performance.
Data Source
AI summary
Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package.