Interposer Encapsulant Prevents Underfill Climbing
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Solution Overview
Problem
The underfill in stacked electronic device packages can climb up the edges of the redistribution structure during the de-carrier operation, making it difficult to remove the carrier and potentially damaging the high-density redistribution structure, which affects the yield and reliability of the semiconductor device package.
Innovation Solution
A semiconductor device package design that includes a redistribution structure with higher circuit density and area than the conductive substrate, where the encapsulant encapsulates the side surface of the conductive substrate, preventing underfill from climbing and facilitating easy carrier removal, and the use of a method that forms a first encapsulant to encapsulate the redistribution structure and conductive substrate, ensuring the electrical connections are protected and the carrier can be reused.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If underfill is used to ensure joint between stacked electronic components, then reliability of electrical connection is improved, but underfill climbs up edges of electronic component making carrier removal difficult
Solution Approach 1:
A release layer is introduced as an intermediary between the carrier and the redistribution structure. This release layer allows the underfill to climb up the redistribution structure without adhering to the carrier, enabling easy carrier removal while maintaining the joint reliability provided by the underfill.
Solution Approach 2:
The interface between the carrier and redistribution structure is segmented by introducing a release layer. This segmentation allows the underfill to interact with the redistribution structure while the release layer prevents adhesion to the carrier, resolving the contradiction between underfill function and carrier removal.
2Reliability
If underfill climbs up edges of redistribution structure, then joint reliability is maintained, but high-density redistribution structure may be damaged during de-carrier operation
Solution Approach 1:
The release layer serves as a mediator that allows the underfill to climb the redistribution structure for reliable joint formation while preventing the underfill from adhering to the carrier during de-carrier operations, thus protecting the high-density redistribution structure from damage.
Solution Approach 2:
The release layer is applied beforehand to the carrier surface to prevent direct contact and potential damage between the underfill/climbing structures and the carrier during subsequent de-carrier operations, cushioning against harmful effects before they occur.
3Ease of manufacture
If carrier is used to support redistribution structure during manufacturing, then manufacturing processability is improved, but carrier removal becomes difficult when underfill climbs up
Solution Approach 1:
A release layer is introduced as an intermediary between the carrier and the redistribution structure, allowing the carrier to support the redistribution structure during manufacturing while enabling easy carrier removal after the underfill has performed its bonding function.
Solution Approach 2:
The release layer is designed to be discarded or separated after serving its purpose of enabling carrier removal, allowing the carrier to be recovered and reused while the redistribution structure remains intact with the underfill in place.
Data Source
AI summary
A semiconductor device package includes a redistribution structure, a conductive substrate stacked on the redistribution structure and an encapsulant encapsulating the redistribution structure and the conductive substrate. The encapsulant encapsulates a side surface of the conductive substrate. A method for manufacturing an electronic device package includes: providing a carrier, forming a redistribution structure on the carrier, mounting a conductive substrate on a first surface of the redistribution structure, forming a first encapsulant to encapsulate the first surface of the redistribution structure and a side surface of the conductive substrate, and removing the carrier.