Interposer Substrate Integrating Ferrite Bead Functionality
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Solution Overview
Problem
Existing circuit modules require the mounting of predetermined circuit elements like ferrite bead elements around cable mount positions on circuit boards, which hinders space utilization and complicates size reduction of the circuit board and module.
Innovation Solution
An interposer substrate with a base body comprising a dielectric and magnetic portion, featuring connection terminal electrodes, circuit-board terminal electrodes, and wiring electrodes that integrate ferrite bead functionality without external circuit elements, allowing for high-frequency signal transmission with low loss and noise reduction on low-frequency signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If ferrite bead elements are mounted on the circuit board around cable mount positions, then noise performance is improved, but space utilization is reduced and the circuit board size cannot be reduced
Solution Approach 1:
The patent merges the ferrite bead element and the interposer substrate into a single integrated structure. The ferrite bead element is formed within the interposer substrate body, eliminating the need for separate mounting of ferrite beads on the circuit board. This integration maintains noise filtering functionality while reducing the overall space required, as the ferrite bead functionality is incorporated into the interposer substrate that already occupies the cable mount position area.
2Object-affected harmful factors
If ferrite bead elements are mounted externally on the circuit board, then noise filtering is achieved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The ferrite bead element and interposer substrate are combined into a single integrated component. The ferrite bead element is formed within the interposer substrate during the same manufacturing process, eliminating separate assembly steps for mounting ferrite beads. This reduces device complexity by integrating multiple functions (signal transmission, impedance matching, and noise filtering) into a single component structure.
3Object-affected harmful factors
If wiring electrodes pass through the magnetic portion, then noise filtering functionality is achieved, but the structural complexity of the base body increases
Solution Approach 1:
The base body is segmented into distinct functional regions: a dielectric portion and a magnetic portion. The wiring electrodes are configured to pass through the magnetic portion to achieve noise filtering, while other wiring electrodes can pass through only the dielectric portion for high-frequency signal transmission. This segmentation allows different electrode configurations to serve different functions within the same interposer substrate, managing structural complexity through functional zonation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient transmission of high-frequency signals with low loss and reduces noise on low-frequency signals without the need for external ferrite bead elements, facilitating compact circuit designs by integrating noise filtering and signal transmission within a single substrate.
Implementation Method 1
The base body includes a dielectric portion and a magnetic portion
Implementation Method 2
a first wiring electrode passing through only the dielectric portion
Data Source
AI summary
An interposer substrate includes a dielectric portion, a magnetic portion, and a first principal surface and a second principal surface opposite to each other. Connection terminal electrodes are each provided on a corresponding one of first principal surfaces of the dielectric portion and the magnetic portion, and are connected to a cable. Circuit-board terminal electrodes are provided on a second principal surface of the dielectric portion and connected to a circuit board. Wiring electrodes are provided inside a base body, and connecting the connection terminal electrodes to the circuit-board terminal electrodes in a predetermined connection pattern. The wiring electrodes include a first wiring electrode passing through only the dielectric portion, and a second wiring electrode passing through the magnetic portion.