Interposer and Flex Circuit Stacking for Compact HBM-GPU Modules
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Solution Overview
Problem
Existing memory modules like HBM cannot be directly assembled vertically with GPUs due to complex circuit layouts and memory interfaces, leading to increased space occupation on circuit boards and limiting component density in mobile devices.
Innovation Solution
An electronic module design using an interposer with a redistribution layer and flexible circuit board allows for the vertical assembly of HBM and GPU, reducing the occupied area by enabling the first and second electronic components to overlap.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If HBM and GPU are mounted on the same side of the base board, then the electronic module can be assembled, but the occupied area on the circuit board increases
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional stacking by embedding the first electronic component in the interposer and placing the second electronic component on the flexible circuit board that covers the interposer, enabling vertical assembly and reducing the occupied area on the circuit board
2Area of stationary object
If HBM and GPU are vertically assembled in a stack, then the occupied area is reduced, but the complex circuit layouts and memory interfaces prevent direct assembly
Solution Approach 1:
The patent introduces an interposer with a redistribution layer as an intermediary between the first electronic component (GPU) and the flexible circuit board (HBM), which simplifies the connection interface and enables vertical assembly despite the complex circuit layouts and memory interfaces
Solution Approach 2:
The patent divides the electronic module into separate functional components (interposer with redistribution layer, flexible circuit board, and electronic components) that can be independently manufactured and then assembled vertically, managing the complexity through modular segmentation
Data Source
AI summary
An electronic module and a method of manufacturing the same are provided. The electronic module includes an interposer, a first electronic component, a flexible circuit board, and a second electronic component. The interposer includes a Redistribution Layer (RDL), and a main body layer. The main body layer is disposed on the RDL and has a recess exposing the RDL. The first electronic component is embedded in the recess of the interposer and electrically connected with the RDL. The flexible circuit board wraps the interposer and the first electronic component. The second electronic component is disposed on the flexible circuit board and overlaps the first electronic component.