Interposer-Coupled Semiconductor Module With Fluid Heat Sink
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Solution Overview
Problem
Traditional semiconductor power modules have high development efforts and limited flexibility, making it challenging to increase power density effectively.
Innovation Solution
The electronic module incorporates a semiconductor package with a die carrier, electrical conductor, encapsulant, interposer layer, and a fluid heat sink, where the interposer layer is embedded in or attached to the heat sink, allowing for improved heat dissipation and flexibility in module design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional semiconductor power modules are constructed on a semiconductor bare die assembly, then the module structure is simple, but the development effort is high and flexibility is limited
Solution Approach 1:
The module is divided into separate functional components: a semiconductor package (with bare die assembly) and a heat sink, connected through an interposer layer. This segmentation allows independent optimization of each component and enables flexible reconfiguration for different applications.
Solution Approach 2:
An interposer layer is introduced as an intermediary component between the semiconductor package and the heat sink. This interposer layer provides mechanical support, electrical connection, and thermal conduction, enabling flexible module design while maintaining structural integrity and performance.
2Power
If power density is increased in semiconductor power modules, then system output power increases, but heat dissipation becomes more challenging
Solution Approach 1:
The semiconductor package is directly coupled with the heat sink through the interposer layer, merging the power-generating component with the heat-dissipating component into an integrated thermal management system. This reduces thermal resistance and improves heat dissipation efficiency.
Solution Approach 2:
The interposer layer serves as a thermal intermediary with high thermal conductivity, efficiently transferring heat from the semiconductor package to the heat sink, thereby managing the thermal challenges associated with increased power density.
3Adaptability or versatility
If an interposer layer is added between the semiconductor package and heat sink, then flexibility and heat dissipation improve, but device complexity increases
Solution Approach 1:
The interposer layer is designed to perform multiple functions simultaneously: mechanical support, electrical connection, and thermal conduction. This multi-functionality reduces the need for separate components and minimizes overall device complexity while maintaining design flexibility.
Solution Approach 2:
The interposer layer utilizes composite material structures (such as DCB or AMB) that integrate multiple functional properties into a single component, achieving flexibility and thermal performance without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces development efforts and enhances flexibility, enabling higher power density and efficient heat management in semiconductor power modules.
Implementation Method 1
a heat sink through which a cooling medium can flow
Implementation Method 2
the interposer layer is one of an isolated metal substrate (IMS), a direct copper bond (DCB), or an active metal braze (AMB)
Data Source
Figure 1
Figure 2A~2D
Figure 3A~3E
AI summary
An electronic module (100) comprises a semiconductor package (10) comprising a die carrier (11), a semiconductor transistor die (12) disposed on the die carrier (11), at least one electrical conductor (13) connected to the semiconductor die (12), and an encapsulant (14) covering the die carrier (11), the semiconductor die (12), and the electrical conductor (13) so that a portion of the electrical conductor (13) extends to the outside of the encapsulant (14), and the module (100) further comprises an interposer layer (13), wherein the semiconductor package (10) is disposed on the interposer layer (20), and a heat sink (30) through which a cooling medium can flow, wherein the interposer layer (20) is disposed on the heatsink (30).