Interposer Frame Assembly Alignment
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Solution Overview
Problem
Existing interposer assemblies face misalignment issues due to dimensional faults in frames, such as warping or twisting, which can render them unusable for aligning circuit boards with contacts, leading to electrical coupling failures.
Innovation Solution
The introduction of a dual-frame interposer assembly comprising a static frame and a biasing frame with angled legs, protruding posts, and biasing members that can be aligned and mounted within the interposer assembly's openings, ensuring proper alignment and retention of circuit boards despite potential manufacturing imperfections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If frames are molded from dielectric materials, then the frames can be manufactured with complex shapes to guide circuit boards, but the frames may warp or twist due to dimensional faults making them unusable
Solution Approach 1:
The frame is divided into multiple segments or sections that can independently accommodate dimensional variations. Each segment can be manufactured separately and then assembled, allowing local adjustments to compensate for warping or twisting in individual sections while maintaining overall alignment functionality.
Solution Approach 2:
The frame design incorporates adjustable parameters such as flexible mounting positions, variable alignment features, or compensatory mechanisms that can be tuned to account for dimensional faults. This allows the frame to adapt to manufacturing variations rather than requiring perfect precision in each component.
2Measurement precision
If tight dimensional tolerances are specified for the interposer assembly, then alignment between circuit board pads and contacts is improved, but frames with dimensional faults become unusable
Solution Approach 1:
The design converts potential harmful effects of dimensional faults into beneficial features by incorporating compliance elements, flexible mounting mechanisms, or adjustment features that actually utilize the dimensional variations rather than fighting against them. This allows frames with normal manufacturing variations to be used effectively while still achieving the required alignment precision.
Solution Approach 2:
The frame or mounting system incorporates dynamic elements that can adjust or adapt during assembly or operation. This might include flexible connectors, adjustable positioning mechanisms, or self-aligning features that compensate for dimensional faults, allowing the system to maintain precision without requiring perfectly rigid components.
3Measurement precision
If frames are designed to guide circuit boards into alignment, then mating accuracy is improved, but any warping or twisting renders the frames unusable
Solution Approach 1:
The frame design incorporates built-in compensation mechanisms that anticipate and cushion against dimensional variations before they affect alignment. This might include pre-loaded springs, compliant mounting features, or adjustment mechanisms that are already in place to absorb dimensional faults, ensuring reliable functionality even when frames exhibit normal manufacturing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures accurate alignment and secure retention of circuit boards with contacts, even if the frames are warped or twisted, thereby maintaining electrical coupling and facilitating reliable soldering, while allowing for the use of frames with dimensional faults.
Implementation Method 1
The biasing frame includes legs joined with and oriented at an angle with respect to one another, with each of the legs having a mounting surface and an opposite upper surfaces interconnected by an inner side. The mounting surfaces have outwardly protruding posts and the inner sides have biasing members.
Data Source
AI summary
An interposer frame assembly includes a static frame and a biasing frame. The static and biasing frames include legs joined with and oriented at an angle with respect to one another. The legs include mounting surfaces and opposite upper surfaces that are interconnected by an inner side. The mounting surfaces have outwardly protruding posts and the inner sides have protrusions extending away from the legs. The posts are received in openings of an interposer assembly such that the static frame and the biasing frame are aligned on opposite sides of a contact field of the interposer assembly. The protrusions of the static frame and the biasing members of the biasing frame guide and retain a circuit board with contacts into a mated relationship with corresponding contacts in the contact field of the interposer assembly.