Interposer Fuse Programming for 3DIC Yield
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently utilizing fuses within three-dimensional integrated circuits (3DICs) for programming and repairing ICs, particularly in achieving reliable electrical connections and flexible circuit configurations.
Innovation Solution
The development of interposers with a substrate, through-vias, and a redistribution layer (RDL) that includes fuses, where fuses are strategically positioned between through-vias and contact pads, allowing for easy programming using a laser to alter connections and enhance manufacturing yields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fuses are formed on semiconductor devices for programming and repairing ICs, then manufacturing yields and usability are improved, but achieving reliable electrical connections and flexible circuit configurations becomes more difficult
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the semiconductor die and the packaging substrate. The interposer contains through-vias that extend through its thickness, with fuses formed on its surface. This intermediary structure provides reliable electrical connections while maintaining flexible circuit configurations, as the fuses can be programmed to connect or disconnect specific circuit paths without affecting the overall device architecture.
2Reliability
If through-silicon vias are used to make connections in 3DICs, then vertical electrical connections are achieved, but fuse programming and circuit repair capabilities are limited
Solution Approach 1:
The patent segments the fuse structure into multiple components: through-vias that provide vertical connections through the interposer, and fuse elements formed on the surface of the interposer. This segmentation allows the through-vias to maintain reliable electrical connections while the surface fuses provide programming flexibility. The fuse elements can be independently programmed using laser techniques to connect or disconnect specific circuit paths, enabling circuit repair and configuration changes without affecting the through-silicon via connections.
3Ease of repair
If laser programming is used to alter fuse connections, then circuit repair and reconfiguration are enabled, but precise laser beam positioning and control become more challenging
Solution Approach 1:
The patent implements preliminary action by forming the fuse structures on the interposer surface before final device assembly. The fuses are pre-configured with defined geometries and positions, and preliminary alignment features are incorporated into the interposer structure. This preliminary preparation simplifies the subsequent laser programming step, as the laser beam only needs to follow predetermined paths to selectively alter fuse connections, rather than requiring complex real-time positioning and control during the programming process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables flexible and efficient programming of fuses within 3DICs, improving manufacturing and packaging yields by allowing for circuit repair and increased usable components without additional costs, and providing multiple current paths.
Implementation Method 1
Fuses are devices that are sometimes formed on semiconductor devices that may be programmed using a laser, by directing a laser beam at the fuse from the top or bottom of the semiconductor device.
Data Source
AI summary
Interposers for semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, an interposer includes a substrate, a contact pad disposed on the substrate, and a first through-via in the substrate coupled to the contact pad. A first fuse is coupled to the first through-via. A second through-via in the substrate is coupled to the contact pad, and a second fuse is coupled to the second through-via.