Semiconductor Package Layout With Ground Pads for Crosstalk Control
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Solution Overview
Problem
Existing semiconductor packages face challenges in preventing crosstalk between signals, which can lead to performance issues and increased size to mitigate these problems.
Innovation Solution
A compact-sized semiconductor package design that includes a package substrate with signal and ground pads, an interposer substrate, signal lines, and connection terminals. The signal lines and pads are arranged to minimize crosstalk, with the first connection terminal overlapping at least a portion of the signal lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If signal lines are arranged close to each other to reduce package size, then compactness is improved, but crosstalk between signals increases
Solution Approach 1:
The patent introduces ground pads as intermediary elements positioned between adjacent signal lines. These ground pads act as shields that electrically isolate the signal lines from each other, preventing crosstalk while allowing the signal lines to remain in close proximity for compact package design.
Solution Approach 2:
The patent applies different functional qualities to different regions of the package substrate. Ground pads are strategically placed in specific locations between signal lines, creating localized shielding zones that prevent crosstalk only where needed, while maintaining overall signal line density for compactness.
2Productivity
If connection terminals are positioned to overlap signal lines for compact routing, then routing efficiency is improved, but electrical interference increases
Solution Approach 1:
The patent positions ground pads between the connection terminals and signal lines, creating an intermediary shielding layer. This allows the connection terminals to vertically overlap signal lines for efficient routing while the ground pads prevent direct electrical interference by acting as a shield.
Solution Approach 2:
The ground pads are positioned in advance between the connection terminals and signal lines to preemptively block electrical interference before it can occur. This preliminary shielding arrangement prevents harmful electromagnetic coupling while maintaining the overlapping configuration for routing efficiency.
Data Source
AI summary
The present disclosure relates to semiconductor packages. An example semiconductor package comprises a package substrate that includes a signal pad and a ground pad, an interposer substrate on the package substrate, a semiconductor chip on the interposer substrate, a plurality of signal lines on a top surface of the package substrate, and a first connection terminal between the package substrate and the interposer substrate. Each signal line of the plurality of signal lines extends in a first direction. The plurality of signal lines and the signal pad are spaced apart in a second direction that intersects the first direction. The plurality of signal lines, the signal pad, and the ground pad are in contact with the top surface of the package substrate. The first connection terminal overlaps at least a portion of the plurality of signal lines in a plan view.