Interposer Routing Structure With Ground Shielding for Signal Integrity
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Solution Overview
Problem
The high wiring density in interposer layers of semiconductor packages leads to signal loss and signal crosstalk issues during signal transmission.
Innovation Solution
The interposer routing structure comprises multiple trace layers with strategically placed ground and power traces, where ground traces isolate power traces from signal traces, and connecting traces ensure efficient power supply and noise shielding, thereby reducing signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wiring density in interposer layer is increased to support complex IC design, then more signals can be transmitted, but signal loss and signal crosstalk increase
Solution Approach 1:
Ground traces are introduced as intermediary elements between power traces and signal traces. These ground traces act as mediators that provide a reference potential and shield signal traces from electromagnetic interference generated by power traces, thereby maintaining signal integrity while supporting high wiring density
Solution Approach 2:
The interposer layer is segmented into distinct functional zones with ground traces strategically placed between power and signal traces. This segmentation creates isolated regions that prevent harmful electromagnetic coupling while allowing both power delivery and signal transmission to coexist at high density
2Reliability
If ground traces are placed between power traces and signal traces to reduce crosstalk, then signal integrity improves, but wiring complexity increases
Solution Approach 1:
The ground traces serve multiple functions simultaneously: they provide electromagnetic shielding between power and signal traces, establish a reference potential for signal traces, and create isolation zones that prevent crosstalk. This multi-functionality reduces the need for additional dedicated shielding structures, thereby limiting the increase in wiring complexity
3Use of energy by moving object
If connecting power traces are used to couple multiple second power traces, then power distribution efficiency improves, but the number of traces increases
Solution Approach 1:
Multiple second power traces are merged and coupled through connecting power traces to form an integrated power distribution network. This merging allows power to be efficiently distributed across multiple traces while the connecting traces provide a unified pathway, reducing the need for separate independent power delivery paths and limiting the overall complexity increase
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances signal integrity by shielding noise and shortening return paths, improving transmission efficiency and reducing power loss in semiconductor packages.
Implementation Method 1
The plurality of second ground traces are located on both sides of the plurality of second power traces, so that the plurality of second ground traces isolate the plurality of second power traces from a plurality of signal traces in the second trace layer
Implementation Method 2
The plurality of third ground traces are coupled to each other by the plurality of connecting ground traces, and the plurality of branch ground traces are located on both sides of the plurality of signal traces in the third trace layer
Data Source
AI summary
An interposer routing structure includes a first trace layer, a bump layer, a second trace layer and a third trace layer. The first trace layer is configured to receive a power. The bump layer is coupled to a die. The second trace layer and the third trace layer are coupled between the first trace layer and the bump layer, and include multiple ground traces and multiple power traces. The ground traces are located on both sides of at least one of the power traces, so that the ground traces isolate the at least one power trace and multiple signal traces. The power traces of the second trace layer are coupled to each other by a connecting power trace, and the ground traces of the third trace layer are coupled to each other by a connecting ground trace.