Multi-Conductive Interposer Ground Member Shielding Signal Interference
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Solution Overview
Problem
The increasing slimness of electronic devices leads to insufficient design margins and signal interference due to reduced gaps between electronic components, affecting the reliability of electrical connections and signal transmission.
Innovation Solution
An electronic device design incorporating a multi-conductive interposer with an insulation member and a ground member surrounding the conductive member to secure electrical connections and reduce signal interference, featuring a first conductive member for signal transmission and a second conductive member connected to the ground for shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are arranged closer together to reduce device size, then device slimness is improved, but signal interference increases and design margin becomes insufficient
Solution Approach 1:
An interposer structure is introduced as an intermediary component between adjacent conductive terminals. This interposer includes an insulation member with a through-hole and a ground member that extends into the through-hole, creating a physical and electrical barrier that shields signal transmission paths from external interference while enabling closer component arrangement
Solution Approach 2:
The ground member is strategically positioned only in specific locations where signal interference is most critical - namely, surrounding conductive terminals that transmit signals. This localized grounding approach provides targeted shielding exactly where needed, rather than uniformly across the entire PCB, thus maintaining design margin while enabling compact layout
2Reliability
If ground members are added around conductive terminals to reduce interference, then signal transmission reliability is improved, but device complexity increases
Solution Approach 1:
The interposer merges multiple functions into a single integrated structure: the insulation member provides electrical isolation, the through-hole creates a shielding cavity, and the ground member provides reference potential and interference suppression. This consolidation reduces the number of separate components needed while achieving reliable signal transmission
Solution Approach 2:
The interposer structure serves multiple purposes simultaneously: it provides mechanical support for adjacent terminals, establishes electrical isolation between signal paths, creates a shielded environment through the ground member, and maintains design margin for signal integrity. This multi-functionality reduces overall device complexity despite adding grounding capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of signal transmission by providing a shielding effect against external interference and allows for a more efficient arrangement of conductive members within the same area, improving the structural integrity and performance of electronic devices.
Implementation Method 1
a ground member that surrounds the insulation member
Data Source
AI summary
An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.