Interposer Heat Spreader for 3D Package Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional 3D Integrated Circuits face inefficiencies in heat dissipation due to the use of multiple Thermal Interface Materials (TIMs) and challenges in reducing package thickness while maintaining communication efficiency between components.
Innovation Solution
The implementation of an interposer with redistribution lines and connectors that acts as both a heat dissipation element and an interconnection layer, eliminating the need for additional TIMs and allowing for efficient heat spread and reduced package thickness without compromising thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple Thermal Interface Materials (TIMs) are used to attach device dies to heat spreader and heat sink, then heat dissipation is achieved, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent combines the heat dissipation functions and interconnection functions into a single integrated heat spreader component. This eliminates the need for multiple separate TIM layers by consolidating the thermal management architecture, thereby improving heat dissipation efficiency while reducing structural complexity.
Solution Approach 2:
The heat spreader is designed to serve multiple functions simultaneously: it acts as both a thermal management component for heat dissipation and an interconnection layer for electrical signals. This multi-functionality reduces the number of separate components and interfaces needed, eliminating the need for multiple TIM layers.
2Length of stationary object
If conventional package structures with multiple layers are used, then communication efficiency is maintained, but package thickness cannot be reduced
Solution Approach 1:
The patent transitions from a conventional planar interconnection architecture to a three-dimensional stacked architecture. By utilizing vertical stacking with the heat spreader serving as an interconnection layer between upper and lower substrate arrays, the design achieves high communication efficiency while significantly reducing the horizontal footprint and overall package thickness.
Solution Approach 2:
The patent implements a nested structure where the heat spreader is positioned between upper and lower substrates, with through-silicon vias (TSVs) providing vertical interconnections through the heat spreader. This nested arrangement allows multiple functional layers to be stacked vertically, achieving high integration density and efficient communication while minimizing package thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation capabilities comparable to metal lids, while maintaining effective interconnection and allowing for significant package thickness reduction without significant temperature increases, even with the removal of EMI shields.
Implementation Method 1
The heat generated in the device dies during their operation needs to be dissipated
Implementation Method 2
The attachment of the device dies to the heat sink is through a Thermal Interface Material (TIM)
Data Source
AI summary
A package includes an interposer, which includes a first substrate free from through-vias therein, redistribution lines over the first substrate, and a first plurality of connectors over and electrically coupled to the redistribution lines. A first die is over and bonded to the first plurality of connectors. The first die includes a second substrate, and through-vias in the second substrate. A second die is over and bonded to the plurality of connectors. The first die and the second die are electrically coupled to each other through the redistribution lines. A second plurality of connectors is over the first die and the second die. The second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate.