Interposer Connector Height Layout for Semiconductor Package Warpage
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving reliable and efficient packaging of integrated circuit devices due to warpage issues, leading to potential cold joints or broken connectors, which affect the integration density and yield of semiconductor devices.
Innovation Solution
The use of connectors with variable heights, achieved by adjusting the pattern density of micro-bumps through the insertion of dummy micro-bumps, allows for better alignment and bonding of integrated circuit devices and wafers, preventing warpage-related issues and enhancing the reliability and yield of semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connectors of uniform height are used for bonding integrated circuit devices, then the manufacturing process is simple, but warpage causes cold joints or broken connectors reducing reliability
Solution Approach 1:
The patent applies local quality by creating connectors with different heights in different regions of the interposer. Specifically, first connectors have a first height in a first region, while second connectors have a second height in a second region. This local variation in connector height compensates for warpage in different areas of the integrated circuit device, ensuring reliable bonding across the entire surface despite the increased structural complexity.
2Manufacturing precision
If dummy micro-bumps are inserted to adjust pattern density, then connector height uniformity is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by forming dummy micro-bumps before forming the actual connectors. These dummy micro-bumps are inserted into the interposer at predetermined locations to adjust the pattern density and control the height of connectors in specific regions. By performing this preparatory action beforehand, the patent achieves precise control over connector height uniformity while streamlining the overall manufacturing process.
3Reliability
If variable height connectors are implemented, then warpage compensation is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies parameter changes by systematically varying the height parameter of connectors across different regions of the interposer. First connectors have a first height while second connectors have a second height, allowing the system to compensate for warpage. Additionally, dummy micro-bumps are used to adjust pattern density, which indirectly controls connector height through the plating process. This approach to parameter variation enables effective warpage compensation while maintaining manageable manufacturing precision requirements.
Data Source
AI summary
In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.