Interposer Hole for Heat Dissipation in Semiconductor Packages
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Solution Overview
Problem
Reducing the thickness of semiconductor device packages to miniaturize electronic devices poses challenges in effective heat dissipation, as existing technologies struggle to efficiently transfer and manage the heat generated by semiconductor chips.
Innovation Solution
The semiconductor device package incorporates an interposer with a hole that allows a portion of the semiconductor chip to protrude and be inserted into the interposer hole, facilitating heat transfer through a heat transfer material layer, which reduces thermal resistance and improves temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of semiconductor device packages is reduced to miniaturize electronic devices, then the size of electronic devices is reduced, but heat dissipation becomes ineffective
Solution Approach 1:
The patent introduces an interposer structure with through-holes that enables heat transfer pathways in the vertical dimension (through the interposer thickness) in addition to horizontal heat spreading. This dimensional transition allows heat to escape through multiple directions, resolving the heat dissipation problem caused by reduced package thickness.
Solution Approach 2:
The interposer acts as an intermediary structure between the semiconductor chip and the package substrate. It provides thermal vias and heat transfer material layers that mediate heat flow from the chip, through the interposer, to the package substrate, enabling effective heat dissipation in thin packages.
2Length of stationary object
If the thickness of semiconductor device packages is reduced, then miniaturization is achieved, but thermal resistance increases
Solution Approach 1:
The interposer incorporates through-holes filled with heat transfer material, creating a porous structure that provides multiple thermal conduction pathways. This porous configuration increases the effective heat transfer area and reduces thermal resistance despite the reduced overall package thickness.
Solution Approach 2:
The patent uses composite material structures including heat transfer material layers with high thermal conductivity positioned between the chip and interposer, and within the interposer itself. These composite materials maintain low thermal resistance even in thin configurations.
3Volume of moving object
If the thickness of semiconductor device packages is reduced, then device size is minimized, but temperature distribution becomes uneven
Solution Approach 1:
The interposer divides the heat transfer function into multiple segments: heat transfer material layers at different positions, through-holes at various locations, and distributed thermal pathways. This segmentation creates multiple independent heat evacuation routes that improve temperature uniformity across the chip surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation by allowing heat to be effectively transferred in both horizontal and vertical directions, thereby improving the performance and reliability of the semiconductor device package.
Implementation Method 1
facilitating heat transfer through a heat transfer material layer, which reduces thermal resistance and improves temperature distribution
Data Source
AI summary
A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the second portion is inserted into the first interposer hole.