Thermally Conductive Interposer for IC Hotspot Cooling
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Solution Overview
Problem
Existing IC packaging technologies are inadequate in selectively cooling hotspots on semiconductor dice, leading to inefficient temperature management and increased power dissipation, which limits chip performance and reliability, especially as transistor density and frequency increase.
Innovation Solution
The implementation of a thermally conductive interposer coupled to the IC die at hotspot contact pads, with thermal and electrical conductivity, using thermal interconnects like nodules to direct heat away from hotspots, and optionally coupled to a heat spreader or heat slug for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If transistor density and operating frequency are increased to improve performance, then processing power increases, but power dissipation and heat generation increase
Solution Approach 1:
The patent extracts heat from specific high power density regions by introducing thermally conductive nodules at hotspot contact pads. These nodules act as localized heat extraction points that pull thermal energy away from hotspots before it can spread to surrounding areas, enabling the system to sustain higher power densities in critical regions without compromising overall thermal management
Solution Approach 2:
The thermally conductive nodules serve as intermediary elements between the die hotspots and the external thermal management system. These nodules mediate heat transfer by providing high thermal conductivity pathways at specific contact pad locations, efficiently conducting heat away from hotspot regions while maintaining electrical isolation where needed
2Temperature
If thermally conductive nodules are placed at hotspot contact pads, then hotspot cooling is improved, but device complexity increases
Solution Approach 1:
The patent achieves multi-functionality by designing nodules that can serve both thermal and electrical functions depending on their material composition and placement. The same nodule structure can provide thermal conduction for cooling while simultaneously serving as an electrical interconnect, or can be configured to provide thermal management with electrical isolation, thereby reducing the need for separate dedicated thermal and electrical components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the overall temperature of the IC die and minimizes temperature differences across the chip, improving performance and reliability by targeted heat removal from hotspots, while being cost-effective and reliable for various IC package designs.
Implementation Method 1
a thermally conductive interposer coupled to the IC die at hotspot contact pads
Data Source
Figure 1
Figure 2A~2B
Figure 3A
AI summary
A method, system, and apparatus for improved IC device packaging is described. In an aspect, an (IC) device package includes an IC die having at one or more contact pads, each contact pad located at a corresponding hotspot on a surface of the IC die. The package also includes a thermally conductive interposer which is thermally coupled to the IC die at the contact pads. In another aspect, an underfill material fills a space between the IC die and the interposer. The interposer may also be electrically coupled to the IC die. In an aspect, the interposer and the IC die are coupled through thermal interconnects or "nodules."