Interposer Hybrid Bonding for High-Density Semiconductor Packages
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving higher integration density and smaller form factors in semiconductor packaging due to limitations in current packaging technologies, which hinder the development of smaller and more efficient electronic devices.
Innovation Solution
The use of an interposer structure with hybrid bonding processes that form direct metal-to-metal and insulator-to-insulator bonds between semiconductor dies and package components, enabling finer bump pitch, smaller form factor packages, and improved electrical and mechanical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional packaging technologies are used, then manufacturing simplicity is maintained, but integration density and form factor shrinkage are limited
Solution Approach 1:
The patent implements Package-on-Package (PoP) technology where a top semiconductor package is stacked vertically on top of a bottom semiconductor package. This nesting approach achieves high integration density and small footprint by utilizing the vertical dimension, allowing multiple packages to occupy the same horizontal space on the PCB.
Solution Approach 2:
The invention transitions from conventional horizontal packaging arrangements to vertical stacking in the third dimension. By stacking packages vertically rather than placing them side-by-side horizontally, the patent achieves higher integration density while reducing the horizontal footprint on the PCB.
2Quantity of substance
If smaller feature sizes are used to increase integration density, then component count increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the semiconductor system into separate packages (top package and bottom package) that can be manufactured independently at different fabrication facilities and process nodes. This segmentation allows each package to be optimized for its specific manufacturing requirements while achieving high overall integration density through vertical stacking.
3Area of stationary object
If vertical stacking is implemented to reduce footprint, then area is reduced, but alignment precision between stacked packages must be extremely high
Solution Approach 1:
The patent introduces an interposer structure as an intermediary component between the top and bottom semiconductor packages. The interposer provides alignment features and bonding surfaces that facilitate precise die-to-die alignment during the stacking process, enabling accurate vertical integration while reducing the overall PCB footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in higher density die-to-die interconnects, improved mechanical endurance, reduced defects, increased yield, and lower power consumption, while allowing for smaller form factors and enhanced electrical performance.
Implementation Method 1
hybrid bonding processes that form direct metal-to-metal and insulator-to-insulator bonds between semiconductor dies and package components
Implementation Method 2
hybrid bonding processes that form direct metal-to-metal and insulator-to-insulator bonds between semiconductor dies and package components
Data Source
AI summary
A package includes an interposer having a first redistribution structure; a first die directly bonded to a first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond; a second die directly bonded to the first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond; an encapsulant around the first die and the second die; and a plurality of conductive connectors on a second side of the first redistribution structure opposite to the first die and the second die.