Interposer Inductor Ground Shielding Quality Factor
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Solution Overview
Problem
Inductors in semiconductor structures face challenges in achieving high quality factors due to inefficiencies in energy storage and magnetic field induction, leading to suboptimal performance.
Innovation Solution
An interposer structure with through vias electrically connected to a ground, a dielectric layer, and an inductor, forming a ground shielding structure that enhances the quality factor of the inductor by reducing losses through strategic arrangement and material selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional inductor structures are used in semiconductor devices, then device integration is achieved, but the quality factor remains low due to energy losses
Solution Approach 1:
A ground shielding structure is introduced as an intermediary element between the inductor and the substrate. This ground shielding structure acts as a mediator that redirects electromagnetic fields and prevents energy loss to the substrate, thereby improving the quality factor without requiring fundamental changes to the inductor design itself
Solution Approach 2:
The patent converts the harmful effect of electromagnetic field interaction with the lossy substrate into a beneficial effect by using the ground shielding structure to redirect these fields. The substrate, which would normally cause energy loss, is transformed into a reference potential plane that actually helps contain and direct the magnetic fields, turning the harmful interaction into a useful shielding effect
2Reliability
If ground shielding structures are added to improve inductor quality factor, then energy losses are reduced, but device complexity increases
Solution Approach 1:
The ground shielding structure is merged with the existing interposer substrate and via structure. Rather than adding a completely separate shielding component, the invention integrates the shielding function into the existing interposer architecture by utilizing through-vias that are already part of the substrate structure, thereby reducing the increase in device complexity
Solution Approach 2:
The through-vias in the interposer substrate serve multiple functions: they provide mechanical support as part of the substrate structure, enable electrical connections to underlying layers, and simultaneously function as ground shields for the inductor. This multi-functionality reduces the need for additional dedicated shielding structures, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interposer structure effectively improves the quality factor of the inductor by minimizing energy losses and enhancing magnetic field induction, thereby approaching the behavior of an ideal inductor.
Implementation Method 1
When a current flows through it, energy is stored in a magnetic field in the coil. When the current flowing through an inductor changes, the time-varying magnetic field induces a voltage in the conductor.
Implementation Method 2
An interposer structure with through vias electrically connected to a ground, a dielectric layer, and an inductor, forming a ground shielding structure that enhances the quality factor of the inductor by reducing losses
Data Source
AI summary
A semiconductor structure is provided. The semiconductor structure includes an interposer structure. The interposer structure includes an interposer substrate, a ground, through vias, a dielectric layer, and an inductor. The through vias are formed in the interposer substrate and electrically connected to the ground. The dielectric layer is on the interposer substrate. The inductor is on the dielectric layer.