Interposer with Integrated 3D Passive Devices
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Solution Overview
Problem
In the fabrication of advanced semiconductor integrated circuits, particularly at nodes below 16 nanometers, the integration of 3D passive devices within an interposer substrate addresses the challenge of reducing die size while minimizing cost and complexity, as traditional passives and I/O devices occupy significant space and incur additional costs without involving advanced node processing.
Innovation Solution
The integration of 3D passive devices within an interposer substrate involves fabricating a first portion within an active region and a second portion within an inter-conductive dielectric layer, coupled with a contact layer and an interconnect layer, allowing for efficient die-to-interposer coupling and system-on-chip interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If passives and I/O devices are included on the active die, then system functionality is achieved, but die size increases and cost increases
Solution Approach 1:
The patent extracts passive devices (capacitors, inductors, resistors) and I/O devices from the active die and relocates them to a separate interposer substrate. This separation allows the active die to be minimized for advanced node processing while passive devices are implemented using thicker, less advanced process nodes on the interposer, thereby reducing overall die size and cost without compromising system functionality.
Solution Approach 2:
The patent introduces an interposer substrate as an intermediary component between the active die and the package substrate. This interposer serves as a mediator that hosts passive devices and I/O devices, enabling the active die to focus solely on high-performance computing functions while the interposer handles I/O and passive components, thus resolving the conflict between functionality and die size.
2Adaptability or versatility
If passives and I/O devices are included on the active die, then system functionality is achieved, but manufacturing complexity increases
Solution Approach 1:
By extracting passive devices from the active die fabrication process and implementing them separately on the interposer using standard, less advanced process nodes, the patent simplifies the manufacturing of the active die. This allows the active die to be produced using cutting-edge advanced node processes without the complexity of simultaneously fabricating passive devices, thereby reducing overall manufacturing complexity while maintaining system functionality.
3Reliability
If advanced node processing is used for all devices, then performance is improved, but cost increases due to including passives on advanced node
Solution Approach 1:
The patent applies different quality levels and process nodes to different functional areas: the active die uses advanced node processing for high-performance computing transistors, while the interposer uses less advanced, more cost-effective process nodes for passive devices. This local differentiation allows each component to be manufactured at the appropriate level, improving overall performance while reducing manufacturing costs by avoiding the expense of fabricating passive devices on advanced nodes.
Data Source
AI summary
An integrated interposer includes an interposer substrate including at least a first portion of a 3D passive device within an active region of the interposer substrate. The integrated interposer also includes an inter-conductive dielectric layer on an active surface of the active region of the interposer substrate, the inter-conductive dielectric layer including at least a second portion of the 3D passive device. The integrated interposer further includes a contact layer coupled to the 3D passive devices and configured to couple at least one die to the integrated interposer. The integrated interposer also includes at least one through via coupled to the contact layer and extending through the interposer substrate to a passive surface of the interposer substrate. The integrated interposer further includes an interconnect layer on the passive surface of the interposer substrate and coupled to the at least one through via.