Interposer with Integrated Circuits for 3D Stacked Semiconductor Power and Signal Integrity
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Solution Overview
Problem
High-capacity and high-performance semiconductor devices face challenges in power supply to stacked semiconductor dies, electrostatic discharge protection, and signal transmission due to parasitic components, which can lead to malfunction and damage.
Innovation Solution
Incorporating an interposer with integrated circuits that function as decoupling capacitors, electrostatic discharge protection circuits, and impedance matching/termination components between the substrate and stacked semiconductor dies, along with conductive vias and solder balls for efficient power supply and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor dies are stacked to increase capacity and performance, then the device capacity and performance are improved, but power supply reliability deteriorates due to difficulty in supplying electric power from lower substrate to upper semiconductor dies
Solution Approach 1:
An interposer is introduced as an intermediary component between the substrate and stacked semiconductor dies. The interposer includes conductive vias that extend through its thickness to provide reliable electrical connections, effectively mediating the power supply from the lower substrate to the upper semiconductor dies and resolving the power supply reliability issue in 3D stacked configurations.
2Ease of manufacture
If semiconductor device structure is simplified, then manufacturing ease is improved, but electrostatic discharge protection capability deteriorates
Solution Approach 1:
The interposer serves as a mediator that incorporates ESD protection circuits without requiring complex modifications to the semiconductor dies themselves. By placing the ESD protection functionality in the interposer layer, the patent achieves effective electrostatic discharge protection while maintaining relative structural simplicity in the overall device architecture.
3Reliability
If parasitic components are reduced, then signal transmission quality is improved, but device complexity increases due to additional interposer structure
Solution Approach 1:
The interposer acts as an intermediary platform that provides controlled impedance signal paths and isolation between the substrate and semiconductor dies. This intermediary structure actually reduces parasitic effects by providing dedicated signal transmission pathways with controlled electrical characteristics, while the added complexity is concentrated in a single intermediate layer rather than distributed throughout the entire device.
Data Source
AI summary
The method of fabricating a semiconductor device may include forming a semiconductor die on a substrate, forming an interposer including at least one integrated circuit connected to the semiconductor die on the substrate or on the semiconductor die, and performing encapsulation to surround the semiconductor die and the interposer.