Interposer-Laminated Circuit Boards for Larger Battery Space
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Solution Overview
Problem
Existing electronic devices face challenges in miniaturization and battery capacity expansion due to the limited space on single-layer printed circuit boards (PCBs).
Innovation Solution
The use of an interposer with a space for mounting via and components between two circuit boards, allowing for lamination and reduction of PCB area, thereby securing a battery extension space equal to the reduced PCB area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a single-layer PCB is used, then the structure is simple and easy to manufacture, but the battery capacity cannot be extended due to limited space
Solution Approach 1:
The patent transitions from a single-layer PCB to a multi-layer laminated structure by adding a second circuit board layered above the first PCB. This dimensional change creates additional vertical space while maintaining a compact footprint, enabling battery capacity extension without increasing the device's planar dimensions.
Solution Approach 2:
The circuit board system is segmented into multiple independent layers (first PCB, second circuit board, and interposer) that can be manufactured separately and then assembled through lamination. This segmentation allows each layer to be optimized independently while creating space for battery extension in the interlayer regions.
2Quantity of substance
If the PCB area is reduced to extend battery space, then battery capacity increases, but the circuit board functionality may be compromised
Solution Approach 1:
An interposer is introduced as an intermediary component between the first PCB and second circuit board. The interposer provides mechanical support, electrical interconnection, and structural stability, ensuring that circuit functionality is maintained while enabling the multi-layer configuration that creates space for battery extension.
Solution Approach 2:
The patent merges multiple functional elements (first PCB, interposer with via spaces, second circuit board) into a single integrated laminated assembly. This combination maintains complete circuit functionality while creating utility spaces within the interposer structure for battery placement, thus preserving reliability while enabling capacity extension.
3Area of stationary object
If an interposer with via mounting spaces is inserted between circuit boards, then PCB area is reduced and battery space is secured, but the device complexity increases
Solution Approach 1:
The interposer is designed to serve multiple functions simultaneously: it provides mechanical support for lamination, creates via mounting spaces for electrical interconnection, defines utility spaces for battery placement, and maintains structural integrity. This multi-functionality reduces the need for separate components, thereby managing complexity while achieving area reduction and battery space creation.
4Quantity of substance
If multiple circuit boards are laminated, then battery extension space is secured, but manufacturing difficulty increases
Solution Approach 1:
The interposer is pre-formed with via holes and mounting spaces created before the lamination process. This preliminary preparation of alignment features, via positions, and utility space boundaries enables more straightforward lamination assembly, reducing manufacturing complexity compared to creating these features after stacking the circuit boards.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the PCB area, allowing for a larger battery extension space, which enhances the usage time of electronic devices by increasing battery capacity.
Implementation Method 1
inserting the interposer, in which a space for mounting via and components therein is formed, between a first circuit board and a second circuit board and by laminating the first circuit board and the second circuit board
Data Source
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AI summary
An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.