Semiconductor Interposer With Lateral Openings For Thickness Control
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Solution Overview
Problem
Existing semiconductor interposers have high thickness distortion and tolerance, exceeding 10%, which is undesirable for applications requiring precise component alignment, such as optical devices.
Innovation Solution
A semiconductor substrate with a carrier and conductive posts, where the carrier has through holes and openings on its lateral surface, allowing for precise placement and connection of electronic components, and is manufactured using injection molding to achieve low thickness tolerance, less than 1%, with conductive posts made of materials like copper or graphene.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional processes for manufacturing interposers are used, then the manufacturing process is simple and flexible, but the thickness distortion and tolerance are high (more than 10%)
Solution Approach 1:
The carrier is designed with pre-formed through-holes and opening structures before the electronic components are mounted. This preliminary structuring allows for precise thickness control and component alignment, reducing the need for post-manufacturing adjustments and achieving thickness tolerance of less than 1%.
Solution Approach 2:
The carrier acts as an intermediary substrate between the electronic components and the final package structure. By incorporating through-holes and openings in the carrier design, it enables precise positioning and thickness control of the assembled interposer, thereby improving manufacturing precision without significantly complicating the overall manufacturing process.
2Manufacturing precision
If an interposer is added to increase the height of thinner electronic components, then the alignment level of components is improved, but the thickness distortion increases (more than 10%)
Solution Approach 1:
The carrier incorporates localized structural features such as through-holes and openings at specific positions to accommodate different electronic components. This local quality approach allows precise thickness control and alignment at critical locations while maintaining overall structural integrity, thereby improving component alignment without excessive thickness distortion.
Solution Approach 2:
The interposer structure is segmented into a carrier with through-holes and openings, allowing different regions to serve specific functions. This segmentation enables precise thickness control in areas where components are mounted, improving alignment precision while managing overall thickness distortion of the interposer structure.
Data Source
AI summary
A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a carrier and a conductive post. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The carrier has a through hole extending between the first surface and the second surface. The carrier has a first opening on the lateral surface. The conductive post is disposed within the through hole.