Interposer Assembly Lateral Shift Interface for Misalignment
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Solution Overview
Problem
Conventional interposer assemblies have limited lateral compliance, which restricts their ability to accommodate substrate misalignment and lateral forces, leading to potential stress on the assemblies and inadequate transmission of forces between substrates.
Innovation Solution
The development of interposer assemblies with top and bottom plates that shift laterally along a shared interface, along with a central circuit board plate in some configurations, allows for increased compliance and secure mounting on misaligned substrates, using pins and collars to manage lateral movement and force transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional interposer assemblies are mounted using pins through holes or alignment collars, then the assemblies can be securely mounted on substrates, but the lateral compliance is limited and cannot accommodate large substrate offsets or lateral forces
Solution Approach 1:
The interposer assembly is divided into multiple segments: top plate, bottom plate, and intermediate compliance mechanism. This segmentation allows each component to perform its specific function - the plates provide structural support and electrical connections, while the intermediate mechanism provides lateral compliance through pin-and-hole clearance or elastomeric materials, resolving the contradiction between adaptability and complexity
Solution Approach 2:
An intermediate compliance mechanism is introduced between the top and bottom plates to mediate lateral movements. This intermediary element (clearance between pins and holes, or elastomeric material) absorbs lateral forces and accommodates substrate offsets without transmitting stress to the electrical contacts, enabling increased lateral compliance while maintaining secure mounting
2Adaptability or versatility
If the lateral compliance is increased to accommodate substrate misalignment, then the interposer assembly can connect misaligned substrates, but the assembly may experience stress or force transmission between substrates
Solution Approach 1:
The design converts potentially harmful lateral forces and substrate misalignments into beneficial compliance through the intermediate mechanism. The clearance between pins and holes or elastomeric material transforms lateral stress into controlled lateral movement, allowing the assembly to accommodate misalignment without transmitting damaging forces to the electrical contacts or substrates
Solution Approach 2:
The intermediate compliance mechanism acts as a cushioning element that absorbs and dissipates lateral forces before they can reach the electrical contacts. By placing this compliant element in advance between the rigid plates, the design protects the assembly from stress and prevents force transmission between substrates, ensuring reliability while accommodating misalignment
Data Source
AI summary
An interposer assembly for forming electrical connections between contact pads on opposed substrates includes a top plate, a bottom plate, a lateral shift interface between the plates and a plurality of electrical circuit paths extending between contact surfaces at the top of the top plate and at the bottom of the bottom plate. The circuit paths maintain electrical connections between opposed pairs of pads on the substrates despite misalignment of the substrates or lateral shifting of the plates at the interface because of forces exerted on the substrates. The plates are secured together to permit limited lateral movement at the interface. The assembly may have a circuit board plate between the top and bottom plates and two lateral shift interfaces. The contacts may have very small and high contact pressure shear-formed contact tips.