Semiconductor Interposer Layout With Lateral-Side Electrical Contacts
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Solution Overview
Problem
Existing semiconductor packages lack the ability to effectively utilize their package size by allowing electrical connections only at the top and bottom surfaces, limiting the number of components that can be packaged.
Innovation Solution
The semiconductor interposer structure includes electrical contacts on its lateral sides, enabling electrical connections between electronic components mounted on different lateral surfaces, allowing for more efficient packaging by utilizing the entire package volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electrical connections are only made at the top and bottom surfaces of the interposer, then the manufacturing process is simple, but the component density and package space utilization are limited
Solution Approach 1:
The patent extends electrical connections from the traditional top-bottom (vertical) dimension to include lateral (horizontal) surfaces of the interposer. This dimensional expansion allows electronic components to be mounted on multiple surfaces including lateral sides, thereby increasing component density without proportionally increasing structural complexity
Solution Approach 2:
The interposer is designed with electrical connection capabilities on multiple surfaces (top, bottom, and lateral surfaces), making it a multi-functional interconnection structure. This universal connectivity allows the same interposer to connect components mounted on different surfaces, maximizing package space utilization
2Volume of stationary object
If electronic components are only arranged at the top and bottom of the interposer, then the device structure is simple, but the package size utilization is inefficient
Solution Approach 1:
The patent utilizes the lateral surfaces of the interposer for mounting electronic components, transitioning from a two-surface (top-bottom) arrangement to a multi-surface arrangement that includes vertical lateral surfaces. This effectively converts unused lateral space into functional mounting areas, improving volume utilization
Solution Approach 2:
The patent enables a three-dimensional arrangement where electronic components are nested around the interposer structure, utilizing top, bottom, and lateral surfaces. This nested configuration maximizes the use of available package volume by arranging components in multiple spatial layers and orientations
Data Source
AI summary
A semiconductor device is provided. The semiconductor device includes a body and an interconnection structure. The body has a first lateral surface and a second lateral surface angled relative to the first lateral surface. The interconnection structure is configured to make electrical connection between the semiconductor device and a first electronic component mounted to the first lateral surface of the body of the semiconductor device and to make electrical connection between the semiconductor device and a second electronic component mounted to the second lateral surface of the body of the semiconductor device.