Thermally Conductive Interposer Layer for 3D-IC Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In three-dimensional integrated chip (3D-IC) structures, heat dissipation is a challenge due to vertical heat conduction, leading to increased power consumption and potential chip failure, especially in densely packed and high-power consumption applications, where existing solutions like large heat spreaders and active cooling are either size-increasing or power-inefficient.
Innovation Solution
A method involving the deposition of a thermally conductive layer with a thickness of at least 10 microns over semiconductor material layers, using materials like copper or graphite, with dielectric coatings and a barrier layer to facilitate lateral heat dissipation, reducing vertical heat concentration and preventing 'hot spots' in stacked chip arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large heat spreader structures are used to dissipate heat vertically, then heat dissipation is improved, but the size of the assembly increases
Solution Approach 1:
The patent introduces a laterally extending thermally conductive layer that redirects heat flow from vertical to lateral directions. This dimensional change in heat dissipation path allows heat to be conducted away from the chip stack horizontally through the interposer substrate, eliminating the need for large vertical heat spreaders and reducing overall assembly volume.
2Temperature
If active cooling systems are used to dissipate heat laterally, then heat dissipation is improved, but power consumption increases
Solution Approach 1:
The patent employs a passive thermal management solution where the thermally conductive layer automatically conducts heat laterally from hot spots without requiring external power input. The system uses the inherent thermal conductivity of materials and natural heat flow gradients to achieve cooling, eliminating the need for powered active cooling systems.
3Area of stationary object
If vertically stacked chip arrangements are used to reduce footprint, then area is reduced, but heat dissipation becomes problematic
Solution Approach 1:
The patent resolves the heat dissipation problem in stacked arrangements by introducing lateral heat conduction paths through the interposer substrate. Instead of allowing heat to accumulate vertically in the compact stack, the thermally conductive layer redirects heat flow horizontally to heat sinks or dissipation regions, enabling high-density vertical stacking without thermal management issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively manages heat dissipation in 3D-IC structures by reducing maximum temperatures and preventing chip performance degradation, maintaining temperatures below critical thresholds while minimizing power consumption and assembly size.
Implementation Method 1
depositing a thermally conductive layer on an in-process unit... facilitate lateral heat dissipation, reducing vertical heat concentration
Data Source
AI summary
An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer.