Interposer Circuit Layer Layout for Crosstalk Suppression

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Solution Overview

Problem

Crosstalk between conductive lines in interposer devices causes signal interference, particularly constructive interference, which degrades communication quality in 2.5D interposer packaging.

Innovation Solution

The interposer device is designed with circuit layers having signal lines and ground lines arranged alternately, and signal transmission directions are configured such that adjacent layers have opposite signal transmission directions, inducing destructive interference to reduce crosstalk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If signal lines are arranged in adjacent circuit layers with parallel signal transmission directions, then device complexity is reduced and manufacturing is simplified, but crosstalk between conductive lines increases due to constructive interference

Engineering Contradiction:

Improvecircuit layer configurationVSAvoidcrosstalk between conductive lines

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent inverts the conventional parallel signal transmission arrangement by configuring adjacent circuit layers to have opposite signal transmission directions. Specifically, if the first circuit layer transmits signals in a positive direction, the second circuit layer transmits signals in a negative direction, and vice versa for subsequent layers. This inversion causes the electromagnetic fields from adjacent layers to interfere destructively, reducing crosstalk between conductive lines while maintaining the simplicity of the circuit layer configuration

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent converts the harmful constructive interference effect into a beneficial destructive interference effect. By deliberately configuring adjacent circuit layers with opposite signal transmission directions, the electromagnetic fields that would normally constructively interfere and increase crosstalk are instead made to destructively interfere, thereby reducing crosstalk between conductive lines and improving signal quality

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Object-affected harmful factors

If circuit layers are configured with alternating signal and ground lines, then signal shielding is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvesignal interferenceVSAvoidline arrangement precision

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent applies local quality by creating alternating regions of signal lines and ground lines within each circuit layer. This local alternation of conductive and reference lines provides continuous shielding along the signal transmission path, reducing electromagnetic interference while maintaining manageable manufacturing precision requirements through localized pattern repetition

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If signal transmission directions in adjacent layers are made opposite, then crosstalk is reduced through destructive interference, but device complexity increases

Engineering Contradiction:

Improvecrosstalk between conductive linesVSAvoidsignal transmission direction configuration

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent implements periodic action by establishing a repeating pattern of signal transmission directions across circuit layers. The direction configuration follows a periodic sequence where each layer's signal transmission direction alternates with its adjacent layers, creating a regular, predictable pattern that reduces crosstalk through consistent destructive interference while avoiding the complexity of irregular or unique configurations

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces crosstalk through destructive interference, improving signal line performance without altering the internal structure of the semiconductor package device, thereby enhancing communication quality.

Implementation Method 1

by configuring the signal transmission direction of the signal lines in the circuit layers according to specific rules, the crosstalk between adjacent signal lines can be reduced due to destructive interference

Methodology Applied

Scientific EffectDestructive interference: Interference

Data Source

PatentUS20250273583A1Interposer device and semiconductor package device

Publication Date: 2025.08.28 GLOBAL UNICHIP CORPORATION

AI summary

An interposer device configured to provide the transmission of communication signals between two chips is provided. The interposer device comprises multiple circuit layers electrically connected between the two chips and arranged along a vertical direction. Each circuit layer is configured to take a first direction or a second direction as a signal transmission direction for transmitting the communication signals. The first direction is opposite to the second direction, and both the first and second directions are different from the vertical direction. Each circuit layer comprises signal lines and ground lines arranged alternately. The projections of the signal lines in one circuit layer along the vertical direction on an adjacent circuit layer overlap the ground lines in this adjacent circuit layer. In any three circuit layers sequentially arranged, the signal transmission direction of the first circuit layer is opposite to the signal transmission direction of the last circuit layer.