Semiconductor Package Interposer Layout for Uniform Encapsulation

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Solution Overview

Problem

Existing semiconductor device packages face challenges in achieving uniform encapsulation of interposers and components during the molding process, leading to uneven flow rates and incomplete coverage.

Innovation Solution

The semiconductor device package incorporates a carrier with first and second surfaces, where first interposers are arranged in an irregular pattern on the first surface and encapsulated by a first encapsulant, and a second encapsulant covers the second surface, ensuring uniform encapsulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If interposers are arranged in a regular pattern, then manufacturing process is simpler, but encapsulation uniformity deteriorates

Engineering Contradiction:

Improveinterposer arrangement simplicityVSAvoidencapsulation uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies asymmetry by arranging interposers in an irregular pattern rather than a regular grid, which creates varied spacing that promotes uniform encapsulant flow distribution across the carrier surface, resolving the contradiction between manufacturing simplicity and encapsulation uniformity

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent implements local quality by positioning interposers with different spacing intervals in different regions of the carrier, allowing the encapsulant to flow uniformly across areas with varying interposer densities, thus achieving consistent encapsulation throughout the package

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If interposers are arranged in an irregular pattern, then encapsulation uniformity is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveencapsulation uniformityVSAvoidinterposer arrangement complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent changes the spatial parameters of interposer arrangement by using non-uniform spacing and irregular positioning patterns, which optimizes encapsulant flow characteristics and achieves uniform encapsulation while managing the increased arrangement complexity through controlled parameter variation

Inventive Principle:

Principle #35Parameter changes

3Productivity

If dual-side assembly is employed to increase package density, then productivity is improved, but encapsulation completeness deteriorates

Engineering Contradiction:

Improvepackage densityVSAvoidencapsulation completeness

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies segmentation by using separate encapsulants for different regions of the dual-side assembly, with the first encapsulant covering the first surface and interposers, and the second encapsulant covering the second surface, ensuring complete and uniform encapsulation across both sides while maintaining high package density

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20250105161A1Semiconductor device package

Publication Date: 2025.03.27 ADVANCED SEMICON ENG INC

AI summary

A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.