Interposer Mechanism for Photonic Element Alignment
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Solution Overview
Problem
Optical communication between computing units, such as printed circuit boards, requires precise alignment of photonic elements to maintain signal integrity and reduce power usage, but achieving this alignment is challenging due to intolerance of rotational, tilt, and shift misalignments, especially in densely packed server environments.
Innovation Solution
An interposer mechanism is introduced between photonic elements, which includes a mechanical guide assembly and optical pathway to align and secure the elements, reducing misalignment and providing a stable optical connection, and optionally incorporates telecentric optics to minimize signal loss from lateral shifts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fibers or waveguides are used for communication between computing units, then signal integrity and power usage are improved, but alignment precision requirements increase to approximately one micron for single mode fibers
Solution Approach 1:
The patent introduces an interposer as an intermediary component between transmitting and receiving photonic elements. This interposer includes alignment features such as mechanical guides, alignment pins, and alignment grooves that facilitate precise co-axial alignment of optical channels without requiring extremely tight tolerances in the photonic elements themselves. The interposer acts as a mediator that absorbs and compensates for alignment variations.
Solution Approach 2:
The alignment features on the interposer and mating assembly are designed to pre-align the photonic elements before final connection. The mechanical guides and alignment features perform the alignment action in advance during the connection process, ensuring that the optical channels are properly co-axially aligned before optical signals are transmitted, thereby eliminating the need for post-assembly alignment adjustments.
2Loss of energy
If alignment precision is increased to minimize optical power loss, then signal integrity improves, but device complexity and connection process complexity increase
Solution Approach 1:
The interposer serves as a simplified intermediary that provides alignment functionality through straightforward mechanical features rather than complex active alignment mechanisms. The alignment pins, grooves, and mechanical guides are passive, simple structures that automatically establish proper alignment when the connector is mated, avoiding the need for complex adjustment mechanisms, sensors, or active alignment procedures.
Solution Approach 2:
The alignment features are designed to be self-aligning, where the mechanical guides and alignment features automatically position the photonic elements correctly during the connection process without requiring external intervention, adjustment, or complex control systems. The connection assembly itself performs the alignment function through its inherent mechanical design.
3Loss of energy
If alignment precision is increased to minimize optical power loss, then signal integrity improves, but the complexity of connection processes increases
Solution Approach 1:
The alignment features are pre-configured on the interposer and mating assembly during manufacturing, so that when the components are connected, the alignment is automatically established without requiring complex assembly procedures. The mechanical guides and alignment features perform the alignment action in advance during the connection process, ensuring that the optical channels are properly co-axially aligned before optical signals are transmitted, thereby eliminating the need for post-assembly alignment adjustments.
Solution Approach 2:
The interposer provides a standardized interface that simplifies the connection process by incorporating all necessary alignment features in one component. This intermediary absorbs the complexity of alignment, allowing the connection process to be straightforward and repeatable without requiring skilled manual adjustment or complex alignment procedures.
4Reliability
If mechanical alignment features are added to reduce misalignment, then signal integrity improves, but device complexity increases
Solution Approach 1:
The alignment functionality is segmented into separate, simple features on the interposer and mating assembly rather than being integrated into a single complex mechanism. The alignment pins, alignment grooves, and mechanical guides are distinct, independent features that work together to provide alignment, allowing each feature to be simple and manufacturable while collectively achieving precise alignment.
Solution Approach 2:
The interposer acts as an intermediary that carries the mechanical alignment features, separating the alignment function from the photonic elements themselves. This allows the alignment features to be optimized for simplicity and manufacturability on the interposer without compromising the performance of the photonic elements, while still achieving the required alignment precision.
Data Source
AI summary
A device for optically coupling two photonic elements may comprise an interposer where each photonic element is axially aligned with an optical pathway in the interposer. Also included is an optics assembly configured to direct a photonic signal along the optical pathway; and a mechanical guide assembly configured to reduce the relative tilt and rotation of photonic elements. Another such device may comprise two connectors where each connector comprises an optical pathway element in which an optics assembly is situated and a photonic element aligned with the optical pathway element. A mechanical guide assembly secures the optical pathway elements in a position so as to reduce the relative tilt and rotation of the photonic elements. A connection for optically coupling two computing units can comprise a partition situated between the computing units and on which an interposer is mounted.