Interposer Metal Block Layout for 3D IC Die Heat Dissipation
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Solution Overview
Problem
As integrated circuits (ICs) increase in functionality and operational speed, they generate more thermal energy, exceeding the dissipation capacity of existing IC packages, particularly in 3DIC packages with multiple stacked dies, where efficient thermal dissipation is crucial.
Innovation Solution
The integration of a metal block with multiple metal layers in an interposer substrate thermally coupled to a semiconductor die, facilitating heat dissipation through metal interconnects and layers, which are part of the interposer substrate fabrication process, providing additional signal routing paths and die-to-die connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple stacked dies are used to increase functionality and operational speed, then die functionality and operational speed are improved, but thermal energy generation increases and exceeds the thermal dissipation capacity of the IC package
Solution Approach 1:
The patent introduces a metal block with multiple metal layers integrated into the interposer substrate, creating a three-dimensional thermal conduction path. This vertical thermal management structure allows heat to dissipate through multiple layers and directions, effectively managing thermal energy from stacked dies without increasing package footprint.
Solution Approach 2:
The metal block serves as an intermediary thermal conduction medium between the stacked dies and the heat sink. The multiple metal layers within the block provide enhanced thermal pathways, acting as an efficient heat transfer bridge that connects the heat-generating dies to the external cooling system.
2Ease of manufacture
If traditional thermal dissipation methods are used, then package structure is simple, but thermal dissipation capacity is inadequate for high-functionality dies
Solution Approach 1:
The patent employs a composite structure combining the interposer substrate with a metal block containing multiple metal layers. This composite design integrates different materials with complementary properties - the substrate provides structural support and electrical interconnection, while the metal block provides enhanced thermal conduction pathways, together achieving both manufacturability and superior thermal dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates thermal energy from the die, enhancing the thermal management of IC packages, particularly in 3DIC configurations, by leveraging the metal interconnects and layers in the interposer substrate to manage heat effectively, supporting increased functionality and operational speeds.
Implementation Method 1
a metal block which comprises a plurality of metal layers and is thermally coupled to the die and a metal interconnect(s)
Data Source
AI summary
Aspects disclosed in the detailed description include an integrated circuit (IC) package employing a metal block with metal interconnects thermally coupling a semiconductor die (“die”) to an interposer substrate for dissipating thermal energy in the die. The die is coupled to a package substrate to provide signal routing paths to the die. To facilitate additional dies being stacked in the IC package as a three-dimensional (3D) IC (3DIC) package, the IC package also includes an interposer substrate adjacent to the die. The interposer substrate supports providing additional signal routing paths to the package substrate. The interposer substrate also includes a metal block which comprises a plurality of metal layers and is thermally coupled to the die and a metal interconnect(s) in the interposer substrate to dissipate thermal energy from the die through the metal block and through the coupled metal interconnect(s).