Semiconductor Package Interposer Positioning via Mold Protrusions
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Solution Overview
Problem
Existing semiconductor packaging methods face challenges in achieving high reliability and preventing interposer slippage during the manufacturing process, leading to potential failures and reduced yield due to inadequate positioning and support mechanisms.
Innovation Solution
The method involves forming an insulative mold layer with protrusions on the semiconductor package substrate, which supports the interposer and prevents slippage by correlating the spacing of protrusions with conductive bumps, and using an under-fill resin to encapsulate conductive connection members, thereby enhancing the structural integrity and reliability of the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional packaging methods are used without protrusions, then the manufacturing process is simpler, but interposer slippage occurs and positioning accuracy deteriorates
Solution Approach 1:
The mold layer is segmented into multiple protrusions that extend upward to contact the interposer at specific locations. These protrusions divide the support function into discrete contact points, providing precise positioning and preventing slippage without requiring complex overall structure changes to the packaging system.
Solution Approach 2:
The mold layer transitions from a flat two-dimensional structure to a three-dimensional structure with upwardly extending protrusions. This dimensional change adds vertical support elements that contact the interposer bottom surface, enabling precise positioning in the horizontal plane while maintaining structural simplicity.
2Reliability
If no under-fill resin encapsulation is used, then the manufacturing process is faster, but voids occur and reliability deteriorates
Solution Approach 1:
The mold layer protrusions are formed in advance to provide preliminary support and positioning for the interposer before the under-fill resin is applied. This preliminary structural preparation ensures proper alignment and prevents slippage during subsequent manufacturing steps, reducing the need for rework and improving overall reliability.
Solution Approach 2:
The under-fill resin acts as an intermediary material that flows into the space between the interposer and substrate, surrounding and encapsulating the conductive connection members. This intermediary substance fills voids and provides mechanical support, enhancing reliability without significantly extending the manufacturing cycle when applied efficiently.
3Stability of the object's composition
If protrusions are added to the mold layer, then interposer slippage is prevented, but the manufacturing complexity increases
Solution Approach 1:
The mold layer is segmented into multiple protrusions that extend upward to contact the interposer at specific locations. These protrusions divide the support function into discrete contact points, providing precise positioning and preventing slippage without requiring complex overall structure changes to the packaging system.
Solution Approach 2:
The mold layer structure is modified by changing the physical parameter of adding upwardly extending protrusions with specific spacing corresponding to conductive bumps. This parameter change provides stable interposer positioning through geometric interlocking, while the protrusions can be formed using standard semiconductor fabrication techniques, maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the occurrence of voids in the under-fill resin and ensures proper alignment of conductive connection members, resulting in improved manufacturing yield and reliability of the semiconductor package by preventing interposer slippage and ensuring effective encapsulation.
Implementation Method 1
performing a reflow process to merge each of the contacting pairs of the first conductive bumps and the second conductive bumps to form a plurality of conductive connection members
Implementation Method 2
flowing an under-fill resin in a space between the interposer and the first substrate to surround and encapsulate the conductive connection members
Data Source
AI summary
A semiconductor package and a method manufacturing the same are disclosed. At least one semiconductor chip is mounted on a package substrate. An insulative mold layer is formed at sides of the semiconductor chip having at least one recess in a region in which conductive connection members are formed, the recess defining one or more protrusions within the mold layer. An interposer is positioned on the protrusions with the conductive connection members connecting and providing electrical connections between conductive pads on the upper surface of the package and conductive pads on the lower surface of the package substrate. The protrusions may position the interposer in the vertical direction by defining the vertical spacing between the lower surface of the interposer and the upper surface of the package substrate. The protrusions may also position the interposer in one or more horizontal directions and/or prevent substantial movement during connecting of the interposer to the package substrate. An under-fill resin layer may be injected into remaining space between the interposer and the package substrate.