Interposer Manufacturing via Molded Wire Embedding
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Solution Overview
Problem
Manufacturing interposers that can adapt and connect components with different pin or pad spacings is complex and challenging due to the need for precise alignment and material properties that ensure electrical conductivity while minimizing manufacturing complexity and costs.
Innovation Solution
The method involves creating an interposer with a molded piece and embedded conducting wires made of conductive materials, using a mold with differently spaced units to accommodate varying pin spacings, and a manufacturing process that includes injection of molding compound, curing, and precise cutting to form pads and wires, allowing for connection between components with different pitch spacings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional interposer manufacturing methods are used, then electrical connection between components with different pin spacings is achieved, but manufacturing complexity and difficulty increase
Solution Approach 1:
The manufacturing process is segmented into distinct stages: injecting molding compound with embedded conducting wires, curing the compound, and cutting the interposer into individual units. This segmentation allows each stage to be optimized independently, reducing overall manufacturing complexity while maintaining the ability to accommodate different pin spacings through the mold design
Solution Approach 2:
The patent introduces an intermediary mold structure that includes conducting wires and molding compound as intermediate elements. The mold acts as a mediator that transforms the raw materials into a pre-formed interposer structure with embedded conductive paths, simplifying the subsequent manufacturing steps and enabling adaptation to different pin spacings through mold configuration
2Manufacturing precision
If precise alignment and complex manufacturing steps are used, then manufacturing precision is improved, but manufacturing time and productivity are reduced
Solution Approach 1:
The conducting wires are pre-positioned and embedded into the molding compound during the injection stage, before the curing process. This preliminary action ensures precise alignment of the conductive paths with the pad locations without requiring complex alignment operations during subsequent manufacturing steps, thereby maintaining high precision while improving productivity
Solution Approach 2:
The patent merges multiple operations into a single injection-molding step: the molding compound, conducting wires, and pad structures are all formed and positioned simultaneously during the injection process. This consolidation eliminates the need for separate alignment and assembly operations, achieving both high precision and improved manufacturing throughput
3Manufacturing precision
If dressing and cutting steps are included, then manufacturing precision is maintained, but manufacturing complexity and costs increase
Solution Approach 1:
The patent extracts the dressing and cutting operations from the traditional manufacturing process. By designing the mold to directly produce interposers with precisely formed pads and conductive paths, the need for subsequent dressing and cutting steps is eliminated, simplifying the manufacturing process while maintaining dimensional accuracy
Solution Approach 2:
The invention changes the manufacturing parameters by using injection molding with embedded conducting wires to directly form the interposer structure. This parameter change allows the pads and conductive paths to be formed with precise dimensions during the molding process itself, eliminating the need for post-processing dressing and cutting operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and effectively connects components with different pin spacings by forming interposers with conductive pads and wires that maintain low resistance, enabling efficient electrical connection while omitting complex dressing and cutting steps.
Implementation Method 1
a molded piece is formed by pouring and cutting, wherein a plurality of conducting wires are embedded into the molded piece
Data Source
AI summary
A method for manufacturing an interposer to connect boards or elements with different pin or pad spacings comprises following steps. A mold with first and second plates is provided. The first plate defines a plurality of first units with a plurality of first holes, the second plate defines a plurality of second units with a plurality of second holes. Space between central lines of adjacent first holes is different from that of adjacent second holes. Conducting wires pass through the first holes and the second holes, and molding compound is injected into the mold to keep the conducting wires in place. A molded plate defining a plurality of plate units is thereby formed, and molded pieces constituting interposers are obtained by cutting the molded plate.