Interposer Multi-Layer Segmentation for Terminal Density
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Solution Overview
Problem
Existing electronic devices face challenges in reducing the size of interposers while maintaining a large number of conductive terminals, leading to potential connection defects and insufficient ground connections.
Innovation Solution
The proposed solution involves an interposer with a dielectric substrate and multiple insulating layers, featuring conductive pads and terminals connected via conductive vias, allowing for a higher density of conductive terminals while improving ground connection structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conductive terminals are arranged to be electrically connected through vias provided through physical machining, then electrical connection is achieved, but the size reduction is limited and the number of conductive terminals that can be arranged is restricted
Solution Approach 1:
The patent introduces multiple insulating layers with conductive pads arranged in different planes (first insulating layer with first conductive pads, second insulating layer with second conductive pads). This multi-layer vertical arrangement allows electrical connection between conductive terminals without requiring through-vias, effectively utilizing the third dimension (depth) to increase terminal density while maintaining a compact interposer area.
Solution Approach 2:
The interposer is segmented into multiple insulating layers, each containing conductive pads at different positions and orientations. This segmentation allows independent arrangement of conductive terminals on each layer, enabling higher density packing of terminals while maintaining electrical connectivity through the layered structure rather than through traditional through-vias.
2Reliability
If conductive terminals of relatively large size are soldered, then electrical connection is established, but connection defects such as short circuits may occur
Solution Approach 1:
By arranging conductive pads on multiple insulating layers at different vertical positions, the patent increases the spatial separation between adjacent conductive terminals. This multi-planar arrangement reduces the risk of solder bridges and short circuits while maintaining reliable electrical connections, as the solder joints are distributed across different planes rather than being confined to a single surface.
3Reliability
If conductive portions on side surface are connected to outermost conductive terminals and ground, then shielding is provided, but terminals for signal transmission may be insufficient
Solution Approach 1:
The patent utilizes the vertical dimension by placing conductive pads on multiple insulating layers. This allows conductive portions on the side surface to be connected to conductive pads in the layered structure, providing shielding while simultaneously freeing up additional terminals on the outer surfaces for signal transmission purposes, as not all terminals need to be dedicated to ground connections.
Solution Approach 2:
The conductive terminal structure is segmented into different functional groups across multiple layers: some conductive pads are dedicated to shielding connections, while others are optimized for signal transmission. This functional segmentation allows both shielding effectiveness and sufficient signal terminals to be achieved within the same interposer structure.
Data Source
AI summary
An electronic device includes a housing, a first substrate, a second substrate, and an interposer disposed between the first substrate and the second substrate and configured to electrically connect the first substrate and the second substrate. The interposer includes a substrate, a first surface, a second surface, and a side surface. The interposer further includes a plurality of first conductive pads, a plurality of second conductive pads, a plurality of conductive posts, a plurality of third conductive terminals at least partially exposed on the first surface and electrically connected to the plurality of first conductive pads via a first conductive via (CV), and a plurality of fourth conductive terminals at least partially exposed on the second surface and electrically connected to the plurality of second conductive pads via a second CV.