Low-Profile Circuit Board Assembly with Interposer Nesting
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Solution Overview
Problem
Traditional surface mount technology (SMT) results in devices that are at least as thick as the height of the circuit board plus the height of the surface mount devices, limiting the miniaturization of electronic devices such as smartphones and laptops.
Innovation Solution
The use of low-profile assemblies comprising a backplane and a component, where an interposer is joined with the component to form a 'T' sub-assembly that is inserted into an aperture in the backplane, reducing the overall thickness by providing pathways for electrical, optical, or mechanical connections, and potentially recessing the assembly within the backplane for further reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional surface mount technology (SMT) is used to place surface mount devices on the surface of a circuit board, then the device can be manufactured with existing SMT processes, but the resulting device thickness is at least as thick as the height of the circuit board plus the height of the surface mount devices
Solution Approach 1:
The patent implements nesting by placing the component assembly (component mounted on interposer) inside an aperture recess in the backplane. The interposer with the component mounted thereon is inserted into the aperture, allowing the component to be nested within the backplane thickness rather than adding to it. This resolves the contradiction by enabling traditional SMT manufacturing processes while achieving reduced overall device thickness through the nesting configuration.
Solution Approach 2:
The patent transitions from a two-dimensional surface mounting approach to a three-dimensional configuration by creating an aperture recess in the backplane and inserting the interposer assembly into it. This dimensional change allows the component to be positioned within the backplane volume rather than on its surface, reducing the overall device thickness while maintaining compatibility with existing manufacturing processes.
2Length of stationary object
If the overall device thickness is reduced below the sum of component and circuit board heights, then thinner electronic devices can be created, but the assembly complexity increases due to the need for interposers and aperture integration
Solution Approach 1:
The patent applies segmentation by dividing the assembly into distinct functional modules: the backplane with integrated aperture, the interposer with mounted components, and the interconnect structures. This segmentation allows each module to be manufactured and tested independently using existing processes, then assembled together to achieve the low-profile configuration, thereby reducing thickness while managing complexity through modular design.
Solution Approach 2:
The interposer serves as an intermediary element between the component and the backplane. It provides the mounting substrate for the component and the interface for electrical interconnections, while its thin profile allows it to be nested within the backplane aperture. This intermediary structure enables the low-profile assembly without requiring direct integration of the component into the backplane, simplifying the overall assembly process.
Data Source
AI summary
Devices and methods for constructing low-profile, minimal-thickness electronic devices using existing production techniques are disclosed in this application. An electronic component and interposer form a sub-assembly. The sub-assembly is placed in an aperture in a circuit board with the interposer providing interconnections between the electronic component and the circuit board. The circuit board is coupled to the electronic component at least by one or more fluidic channels included in the interposer. The sub-assembly placed in the aperture in the circuit board as described herein conceals the thickness of the integrated circuit within the thickness of the circuit board, reducing overall thickness.