Interposer With Opening For Integrated Circuit Package
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Solution Overview
Problem
The challenge is to create an integrated circuit package system that reduces the vertical profile and board real estate usage while minimizing costs, as existing technologies struggle to achieve miniaturization and higher packaging density in portable devices.
Innovation Solution
The solution involves connecting a carrier and an integrated circuit with an interposer having an opening, and forming an encapsulation planar with the carrier and interposer vertical sides, which reduces material usage and simplifies the encapsulation process, allowing for increased integration density and reduced wire sweep failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional molding approaches are used to encapsulate the interposer and integrated circuit, then the vertical profile and board real estate are reduced, but the encapsulation process becomes complex and material usage increases
Solution Approach 1:
The patent extracts the interposer from the traditional fully-encapsulated structure by providing an opening that exposes the interposer top surface. This eliminates the need for complex pre-encapsulated mold caps while reducing the vertical profile of the encapsulation structure.
Solution Approach 2:
Instead of encapsulating the interposer first and then mounting the integrated circuit (conventional approach), the patent inverts the sequence by mounting the integrated circuit on the exposed interposer top surface through the opening, then forming the encapsulation structure around them. This reversal simplifies the manufacturing process and reduces material usage.
2Reliability
If pre-encapsulated mold caps are used to protect interconnects, then wire sweep failures are prevented, but manufacturing costs and device complexity increase
Solution Approach 1:
The patent applies preliminary protective action by forming the encapsulation structure with sidewalls that extend alongside the interconnects before wire sweeping occurs. This preliminary encapsulation protects the interconnects from wire sweep failures without requiring separate pre-encapsulated mold caps.
Solution Approach 2:
The encapsulation structure acts as an intermediary element that provides mechanical protection to the interconnects during the wire sweeping process. The encapsulation sidewalls serve as a protective barrier between the wire sweep tool and the delicate interconnects, preventing failures without adding complex pre-encapsulated structures.
3Reliability
If more encapsulation material is used to ensure complete coverage, then protection is improved, but material costs and environmental impact increase
Solution Approach 1:
The patent applies local quality by providing differential encapsulation coverage: the encapsulation structure fully covers the integrated circuit and carrier while leaving the interposer top surface exposed through the opening. This localized approach ensures adequate protection where needed (IC and carrier) while minimizing material usage where full coverage is not required (interposer).
Solution Approach 2:
The patent uses partial encapsulation action by forming an opening that exposes a portion of the interposer top surface. This partial encapsulation approach provides sufficient protection for the integrated circuit and interconnects while reducing encapsulation material usage compared to complete encapsulation of all components.
Data Source
AI summary
An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.