Interposer With Opening For Integrated Circuit Package System
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in miniaturization, leading to increased complexity and cost in manufacturing, while struggling to achieve low cost, improved yield, and reliability, especially in portable devices where smaller and thinner LSI packages are required.
Innovation Solution
An integrated circuit package system is developed by mounting a first integrated circuit over a carrier, using an interposer with an opening and overhang, connecting internal interconnects between the carrier and interposer, and forming an encapsulation over the integrated circuit, interconnects, and carrier, which allows for additional device mounting under the interposer and increased circuit density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional resin encapsulation with custom mold chase or dam structures is used to create cavities or recesses, then package miniaturization and stacking capability are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the cavity formation process from the resin encapsulation step by using a standalone interposer component with pre-formed cavities or recesses. This interposer is mounted on the package substrate, eliminating the need for custom mold chases or dam structures in the resin molding process, thereby reducing manufacturing complexity while enabling package stacking and miniaturization
Solution Approach 2:
The package structure is segmented into distinct functional components: the package substrate, the interposer (separate from substrate), and the resin encapsulation. The interposer is a discrete component that can be manufactured independently with integrated cavities, allowing it to be mounted separately rather than requiring complex integrated cavity formation in the resin mold
2Quantity of substance
If package stacking or POP design is implemented to increase density, then component packaging density is improved, but manufacturing steps and process complexity increase
Solution Approach 1:
The interposer is prepared in advance with pre-formed cavities, recesses, or windows that are ready to receive stacked packages or ICs. This preliminary preparation of mounting locations on the interposer eliminates the need for complex post-resin-molding operations to create cavities, simplifying the overall manufacturing process while enabling package stacking
Solution Approach 2:
The interposer serves as an intermediary component between the package substrate and the stacked packages or ICs. It provides a standardized interface with pre-formed mounting locations, simplifying the stacking process by mediating between the substrate and multiple layers of stacked components without requiring complex direct integration
3Adaptability or versatility
If windows are created in resin encapsulation for non-POP designs, then device functionality is improved, but manufacturing challenges and complexity increase
Solution Approach 1:
The window or opening formation is extracted from the resin encapsulation process and transferred to the interposer component. The interposer is manufactured with windows, cavities, or recesses already formed, which are then mounted on the substrate. This eliminates the need to create windows in the cured resin encapsulation, significantly easing manufacturing while maintaining device functionality
Data Source
AI summary
An integrated circuit package system includes: mounting a first integrated circuit over a carrier; mounting an interposer, having an opening, over the first integrated circuit and the carrier with the interposer having an overhang over the carrier; connecting an internal interconnect, through the opening, between the carrier and the interposer; and forming an encapsulation over the first integrated circuit, the internal interconnect, and the carrier.