Interposer Package Structure for Substrate-Free 3D Component Integration
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Solution Overview
Problem
The semiconductor industry faces manufacturing challenges in developing 3D-IC packages that effectively integrate additional electrical components without additional substrates, such as printed circuit boards, while maintaining high integration density and reducing package size and cost.
Innovation Solution
A package structure and method involving a first and second redistribution structure on opposite sides of an interposer, with a molding compound layer surrounding the interposer, allowing for integration of surface-mount devices without a substrate, using conductive pillars, passivation layers, and redistribution structures to form electrical connections between semiconductor dies and SMDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional substrates (e.g., printed circuit boards) are used to integrate electrical components, then functionality and component integration are improved, but package size, cost, and complexity increase
Solution Approach 1:
The patent merges the functions of multiple substrates into a single substrate by integrating redistribution structures, conductive pillars, and electrical components directly onto one substrate. This consolidation eliminates the need for additional substrates while maintaining component integration capabilities, thereby reducing package size and structural complexity
Solution Approach 2:
The patent transitions from a planar two-dimensional substrate layout to a three-dimensional structure by stacking semiconductor dies, conductive pillars, and redistribution structures in vertical layers. This vertical integration allows multiple electrical components to be integrated without expanding the horizontal package footprint
2Adaptability or versatility
If additional substrates are used to integrate electrical components, then functionality is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple functional layers (semiconductor dies, conductive pillars, redistribution structures, and electrical components) into a single integrated package structure. This merging reduces the number of discrete substrates and interconnections required, thereby simplifying manufacturing processes and reducing overall package complexity
Solution Approach 2:
The substrate in the patent serves multiple functions simultaneously: it provides mechanical support, electrical interconnection through conductive pillars and redistribution structures, and mounting for semiconductor dies and electrical components. This multi-functionality eliminates the need for separate specialized substrates, reducing structural complexity
3Quantity of substance
If minimum feature size is reduced to improve integration density, then component integration is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent addresses manufacturing precision challenges by transitioning from two-dimensional planar features to three-dimensional vertical structures. Conductive pillars and stacked semiconductor dies utilize the vertical dimension to achieve high integration density without requiring extremely small lateral feature sizes, thereby relaxing manufacturing precision requirements
Data Source
AI summary
A package structure is provided. The package structure includes a first redistribution structure and an interposer over the first redistribution structure. The interposer includes a through via electrically connected to the first redistribution structure and a conductive pillar over the through via. The package structure also includes a first molding compound layer surrounding the interposer. The package structure further includes a second redistribution structure over the first molding compound layer and electrically connected to the conductive pillar. The package structure also includes a semiconductor die over and electrically connected to the second redistribution structure.