Interposer Package Opening for Semiconductor Chip Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor packages face issues with heat dissipation, leading to overheating and potential damage due to encapsulating materials covering the semiconductor chip, which impedes effective heat dissipation.
Innovation Solution
An electronic package design featuring a carrier structure with an interposer plate having an opening to expose the semiconductor chip, accompanied by a thermal conductive block placed in the opening to enhance heat capacity and provide a dissipation path, along with an encapsulation body covering the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor chip is covered with encapsulating material, then the chip is protected, but heat dissipation is impeded causing overheating
Solution Approach 1:
The encapsulating material is segmented to create an exposed region that does not cover the entire semiconductor chip. This segmentation allows the chip to be divided into covered regions (for protection) and exposed regions (for heat dissipation), resolving the contradiction between protection and thermal management.
Solution Approach 2:
Different regions of the semiconductor chip receive different treatments: some regions are covered with encapsulating material for protection, while specific local regions remain exposed to facilitate heat dissipation. This local differentiation allows simultaneous achievement of protection and thermal management.
2Temperature
If the semiconductor chip is fully exposed, then heat dissipation is improved, but the chip becomes vulnerable to damage
Solution Approach 1:
The encapsulation structure is segmented rather than complete, creating specific exposed regions on the chip surface. This segmentation strategy allows the chip to maintain protection in covered areas while exposing sufficient surface area for effective heat dissipation, avoiding the need for full exposure.
Solution Approach 2:
The encapsulating material is applied selectively to specific regions of the chip, leaving other local regions exposed. This local quality approach ensures that protection is provided where needed while heat dissipation pathways are maintained in exposed areas, avoiding the vulnerability of complete exposure.
3Ease of manufacture
If encapsulating material covers the entire chip, then manufacturing is simplified, but thermal management becomes difficult
Solution Approach 1:
The encapsulation process is segmented into stages or regions, allowing standard encapsulation techniques to be used while creating specific exposed areas. This segmented approach maintains manufacturing simplicity by using conventional processes rather than requiring entirely new manufacturing methods.
Solution Approach 2:
The encapsulating material is applied with local quality variations, providing full coverage in some regions and partial or no coverage in thermal-critical regions. This localized differentiation allows the manufacturing process to remain relatively simple while achieving improved thermal management through strategic exposure of heat-generating areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively increases heat dissipation capabilities, preventing overheating and potential damage by exposing the semiconductor chip and providing a dedicated heat dissipation path through the thermal conductive block.
Implementation Method 1
a thermal conductive block is provided on the electronic element
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which an electronic element and an interposer plate are provided on a carrier structure, so that the interposer plate covers the electronic element, wherein the interposer plate is formed with an opening such that the electronic element is exposed from the opening, and a thermal conductive block contacting the electronic element is placed in the opening to provide a heat dissipation path for the electronic element via the thermal conductive block.