Interposer Package Encapsulation to Reduce Corner Stress

Solution Overview

Problem

The challenge in multi-die packages is to effectively arrange and choose packaging materials relative to semiconductor dies, impacting the reliability of packaged products.

Innovation Solution

A semiconductor package structure is developed, where semiconductor dies are mounted on an interposer, and a molding compound encapsulates the dies laterally, wrapping around the interposer and contacting its sidewalls, thereby enhancing protection and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If semiconductor dies are mounted on an interposer with conventional packaging materials arrangement, then the packaging process can be completed, but corner stress increases and delamination risk rises

Engineering Contradiction:

Improvepackage reliabilityVSAvoidcorner stress

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The patent applies preliminary action by pre-forming grooves in the molding compound before mounting the semiconductor dies. These grooves are positioned to extend along the sidewalls of the interposer, creating stress-relief structures in advance that prevent corner stress accumulation during subsequent packaging operations and improve long-term reliability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent segments the molding compound by introducing grooves that divide the continuous material into regions separated by these channels. This segmentation allows the molding compound to better accommodate thermal expansion and contraction differences between components, reducing stress concentration at critical corners and interfaces where delamination would otherwise occur.

Inventive Principle:

Principle #1Segmentation

2Reliability

If semiconductor dies are mounted on an interposer with conventional packaging materials arrangement, then the packaging process can be completed, but delamination occurs at interfaces

Engineering Contradiction:

Improvepackage reliabilityVSAvoidinterface stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent applies preliminary action by pre-forming grooves in the molding compound before mounting the semiconductor dies. These grooves are positioned to extend along the sidewalls of the interposer, creating stress-relief structures in advance that prevent corner stress accumulation during subsequent packaging operations and improve long-term reliability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent segments the molding compound by introducing grooves that divide the continuous material into regions separated by these channels. This segmentation allows the molding compound to better accommodate thermal expansion and contraction differences between components, reducing stress concentration at critical corners and interfaces where delamination would otherwise occur.

Inventive Principle:

Principle #1Segmentation

3Reliability

If semiconductor dies are mounted on an interposer with conventional packaging materials arrangement, then the packaging process can be completed, but cracking risk increases

Engineering Contradiction:

Improvepackage reliabilityVSAvoidcrack resistance

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies preliminary action by pre-forming grooves in the molding compound before mounting the semiconductor dies. These grooves are positioned to extend along the sidewalls of the interposer, creating stress-relief structures in advance that prevent corner stress accumulation during subsequent packaging operations and improve long-term reliability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent segments the molding compound by introducing grooves that divide the continuous material into regions separated by these channels. This segmentation allows the molding compound to better accommodate thermal expansion and contraction differences between components, reducing stress concentration at critical corners and interfaces where delamination would otherwise occur.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS12283541B2Manufacturing method of semiconductor package

Publication Date: 2025.04.22 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.